Electronics Forum | Wed Jan 21 12:06:48 EST 2004 | Claude
What is the most effecient form of heating ,ie calrod, IR, convection , or a mixture ? to produce a good thermal profile on a wavesoldering system on thermally challenging multi-layered boards? Thanks, Adam Adam, I agree with Pete C. Forced co
Electronics Forum | Mon Jan 26 03:45:37 EST 2004 | Vinny
Hi All, We are producing a veriety of RF related PCBAs in which we see Unsolder/Mislaigned on a regular basis. In these baords usually one of the pad is connected to a signal trace and the other pad is connected to very huge ground plane. This gro
Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny
Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera
Electronics Forum | Thu Jan 29 06:58:40 EST 2004 | davef
Ramp / Soak: Tombstoning is occuring during reflow. You need to get more heat into the ground plane. Obviously a ramp aint gettin' it done. Further, without intending to disrespect your internal discussion, if a linear profile improved the situati
Electronics Forum | Mon Jan 26 20:11:02 EST 2004 | davef
The primary driver to the set points for your oven is not the board or the number of zones in your oven. It's your paste. If you need a "ball park" guesstimate as a starting point, your equipment supplier is probably the best place to start. So fo
Electronics Forum | Tue Jan 27 03:59:51 EST 2004 | KevC
Hi lads, Can anyone tell me a bit about PT500 application software? I recently had to replace the Hard drive in the host PC for our wave. I re-loaded the system software and re-configured. One thing I noticed however is in the "Calibrate T/C's" opti
Electronics Forum | Fri Jan 30 09:29:22 EST 2004 | caldon
Joe- You confused me In the subject it has SMT and in a posting you say Through hole components. I was incharge of getting equipment for a research and teaching facility called ACI (Some know it as the EMPF). I was tasked with getting equipment at n
Electronics Forum | Mon Feb 09 14:31:38 EST 2004 | Brent
There is standard pick and place equipment such as the Assembl�on (formerly Philips EMT) ACM Micro and AQ-1 that can easily handle your snap-fit through-hole BNC connectors, in addition to other surface mount components and through-hole odd form part
Electronics Forum | Wed Jan 28 08:11:20 EST 2004 | stefwitt
Martin, may I ask what your offer is? Does the pick and place machine vendor provide you with a special nozzle, which would not require the peel off cover. Custom nozzles from the OEM are quite expensive, because they implement engineering and test.
Electronics Forum | Tue Feb 03 12:39:20 EST 2004 | paul_bmc
We had the data at the time and it was quite high. More false calls then anything. I do not have the data anymore it since has been archived. When the system was introduced we had 1 engineer and 2 operators trained for programming and running the
