Electronics Forum | Mon Sep 02 00:10:51 EDT 2002 | Steve O'Brien
Does anybody know if you can get low cost RFID devices suited to the SMT manufacturing process. I am looking for a way of tracking PCBs without using barcodes, instead I would like to use RFID technology.
Electronics Forum | Tue Sep 03 16:12:07 EDT 2002 | tenison
And we though macaroni and cheese and a stick was new??!! Everything at the Minnesota state fair is on a stick. I bet these twinkies would be good on a stick????? Tenison Stone Telex Communications
Electronics Forum | Wed Sep 04 12:40:33 EDT 2002 | dragonslayr
yup, I can see the advantage of a stick - you can get the pastry delight still sizzlin from the fryer and be able to hold on for a fast grazing - followed by a quick guzzle of yer favorite Starbucks brew
Electronics Forum | Wed Sep 04 17:15:19 EDT 2002 | stockley
This is small fry, you guys need to get yourselves to Scotland and try a deep fried pizza... or maybe a Mars bar... mmmm yummy.
Electronics Forum | Wed Sep 04 21:34:43 EDT 2002 | caldon
I guess I can figure out what the next posting will be...."My Components do not soldering" Further analysis determins....Twinkie Goo and and all of it elements are not good for hi yield production. Someone needed to add technical content.
Electronics Forum | Thu Sep 05 14:25:04 EDT 2002 | melo_guy
Where can i get some samples for "Testing" purposes? I'd like to put them on my AVL. I need to do Extensive designing...
Electronics Forum | Wed Sep 04 14:38:04 EDT 2002 | slthomas
Thank you for not mispronouncing that phrase ala Wayne's World. We here in the Seattle area are sensitive to that stuff, ya know?
Electronics Forum | Tue Sep 10 22:29:01 EDT 2002 | scottefiske
Many times after initially cleaning in the solvents recommended by the paste/material manufacturer, a light white haze may still be visable...try using a soft bristle brush to remove the remaining residues. By this time the residues that remain will
Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic
Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than
Electronics Forum | Tue Sep 10 08:22:36 EDT 2002 | davef
I doubt that the interposer is FR4, it's more likely to be BT. Warp during reflow is a function of material a reflow recipe. Your ramp is too fast and is causing the interposer to bend like a potato chip.
