Electronics Forum | Fri Oct 10 13:35:56 EDT 2003 | swagner
Does anyone have any data about the dangers of reflowing BGA's twice? I have a customer that is concearned about cracking in the intermetallic layer after the second pass. Thanks in advance.
Electronics Forum | Mon Oct 13 14:12:10 EDT 2003 | davef
PTH DIP that have been prepped to become SM can be very unreliable, depending on how the part is prepped. Consider asking your customer to do a failure analysis of those solder connections.
Electronics Forum | Mon Oct 13 11:41:22 EDT 2003 | pjc
Call tech support at 1-800-737-8110. They can give you p/n and price for the manual. Have your machine s/n handy.
Electronics Forum | Thu Oct 16 09:48:02 EDT 2003 | davef
We have been unimpressed with the capability and control of temperatures in batch ovens. We are unfamiliar with the oven you selected. Consider investing and using in a external temperature monitor [profiler].
Electronics Forum | Fri Oct 17 15:26:09 EDT 2003 | pjc
Dave, Its the APS (Automated Production Systems, Inc- Huntingdon Valley PA) oven - www.apsgold.com/reflow.htm Go to GF-B I agree on your comment on batch ovens.
Electronics Forum | Mon Oct 20 15:33:18 EDT 2003 | severs
APS themselves is a good source for learning how to use this oven. Have you talked to them?
Electronics Forum | Tue Oct 21 10:59:49 EDT 2003 | AXL
Hey Russ I hate to say it but you switched from Indium for no reason! If you were getting residue then your oven profile was off! Your flux should have burned off if it was done correctly, that's the purpose of "no-clean".
Electronics Forum | Mon Oct 13 13:49:29 EDT 2003 | mrmaint
Does anyone know of a standard stencil thickness for BGA'S. We currently use 4 to 5 mil stencils depending on component mix. Is an aperature reduction required for BGA'S. If so what percentage. Any help would be greatly appreciated. Thanks MRMAINT
Electronics Forum | Mon Oct 13 19:04:47 EDT 2003 | davef
Aperture size should vary with the component [pitch]. That size should be the same a the pad size. So, generally pinching is not required. Indium discusses BGA apertures on their site [ http://www.indium.com ]
Electronics Forum | Mon Oct 13 17:05:35 EDT 2003 | MA/NY DDave
Hi The answer is yes, These moles, as you called them, are designed more as process control test instruments than true representations of the products that you will process. By The Way, Most don't know this so I congratulate you. Many get schnoke
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