Electronics Forum | Mon Sep 28 12:25:13 EDT 2009 | vleasher
Could someone point me in the direction of some good manufactures of batch style curing ovens? We have a new project requiring Humiseal 2A64 and we do not have an oven for the 3hrs @ 170F cure. Thanks in advance!
Electronics Forum | Mon Sep 28 14:27:08 EDT 2009 | soudomphong
I need help with conveyor speed in Omni Excel 7. It fluctuate, and never have a steady speed. I swapped the speed control card,calibrated, encoder, and I still have the same problem. Any help would be appreciated, thanks.
Electronics Forum | Tue Sep 29 07:19:12 EDT 2009 | hussman
Does it ramp up and dowm or do you get a jerk in the conveyor every so often? Jerk in the chain is a sticky link in the chain. Lube may work but if really bad needs replacement.
Electronics Forum | Tue Sep 29 13:03:01 EDT 2009 | soudomphong
Thank you for responding. I called Speedline tech support he think there is a short some where in the motor. I changed the motor out and still have the same problem. The chain is normal, and using automatic lubricating. I will check more into this, a
Electronics Forum | Wed Sep 30 08:21:07 EDT 2009 | cunningham
Hi We have a board at the moment thats passing ICT and passing functional test but its failing test after conformal coating has anyone had any experinces of this? or any idea what may be causing this?
Electronics Forum | Wed Sep 30 14:17:06 EDT 2009 | davef
What does failure analysis of the BGA indicate? Is this: * ESD damage * Open circuits * Shorting What's the problem?
Electronics Forum | Thu Oct 01 03:03:29 EDT 2009 | cunningham
what we are getting is open circuits not every BGA is failing we use Humiseal 1A33 and currently there is no masking instruction for around the BGA
Electronics Forum | Mon Oct 05 04:55:42 EDT 2009 | pengliang
we suggest as below : the first : check the soldering(solder ball and pad) by X-ray ; second: to do dye analyse (note:pls confrm is there have crack )
Electronics Forum | Thu Oct 15 11:04:28 EDT 2009 | spitkis2
Thanks Jim. Pressing the QFN into paste was what I thought of, just wasn't sure if it would cause solder paste to be pressed outside the pad area and possibly bridge with an adjacent pad. Do you recall the ratio of paste coverage to the pad area?
Electronics Forum | Fri Oct 16 14:45:58 EDT 2009 | cyber_wolf
Many pick and place platforms rely on nozzle spring pressure to determine how hard a part is getting pushed into the paste.
