Electronics Forum | Mon Jul 30 21:07:35 EDT 2001 | davef
So, yer loosing parts between place and reflow? That would seem to say yer: * Paste has lost tackiness [check the fine SMTnet Archives for a sample test.]. * Really not placing the parts that you think yer placing. * Knocking the parts out of place
Electronics Forum | Tue Jul 31 20:06:55 EDT 2001 | davef
you look like a pizza with bicycle parts, instead of anchovies. SITUATION #2: You are riding your bicycle with �souper woad gwabber� tires and a 50 ton dump truck loaded with animal waste smashes in to you and knocks you and your bike over a cliff
Electronics Forum | Mon Jul 30 10:23:30 EDT 2001 | hinerman
From the questions that I am asked from week to week, there are a number of key differentiating factors for tooling classes. They could be considered the headings of a decision matrix, where the tooling options are rows and the following items are c
Electronics Forum | Mon Jul 30 10:32:46 EDT 2001 | hinerman
There are three types of tooling, on a continuous scale a. Manual b. Semi-Automatic c. Automatic An example of a manual system is magnetic pins or a setup where pins drop into a fixed grid. Semiauto would be a system that automatically sets the t
Electronics Forum | Fri Aug 03 12:30:34 EDT 2001 | hinerman
This technology currently works with stencil printers, placement machines, and dispensing equipment with equal success. Not all are commercially available yet. The placement machines with a moving table and weight resrtrictions are more of a chal
Electronics Forum | Tue Jul 31 10:41:49 EDT 2001 | ronho
I'm interested in process information from someone who has experience with this package, such as pad design, stencil aperture dimensions, stencil thickness, unique issues, profiling, solder paste. Design is considering this package for future produc
Electronics Forum | Tue Jul 31 17:16:07 EDT 2001 | davef
Two places to start your search are: 1 Look at last months "SMTnet OnBoard" Forum with Gil Zweig of Glenbrook Technologies. Gil presented his thoughts on the completary capabilities of xray and whatever he called the ERSA scope. 2 Review the fine
Electronics Forum | Fri Aug 17 09:52:21 EDT 2001 | Mike Kennedy
We have looked into it and were very impressed. I havn't seen another peice of equipment that can bring back visual inspection to a BGA solder joint. We havn't yet purchased one because of budget constraints, but I am keen to eventually get one for o
Electronics Forum | Fri Aug 17 17:49:25 EDT 2001 | slthomas
Saw one at Apex last year, pretty cool device. Not cheap, though, as you've stated. Zarrow thinks everyone that's doing BGA should have one. O.C. White makes an instrument that does something quite similar, although I think it uses more mirrors and
Electronics Forum | Wed Aug 01 10:28:11 EDT 2001 | btaylor
We have this problem with our High Temp. solder lines. Tombstoning is actually the term used in our facility. We found that the component termination width was a main contributor also profile ramp rates. Visual inspection will catch most of these rej