Electronics Forum | Thu Dec 23 03:53:15 EST 1999 | Wolfgang Busko
I thought it might be something from baseball but I must admit that my concentration watching this game was more on the outfield action and on trying to understand the rules. And besides, couple of years passed since my stay in US. Yeah at first sig
Electronics Forum | Thu Dec 16 17:50:03 EST 1999 | LUIS LOPEZ
Hi, I am new on this, I want to ask you what is HASL finish, OSP, FPY, ppm. About to eliminate the Nitrogen in reflow soldering, a listen about one solder paste that no requires Nitrogen, the solder paste is called Indium, I don't know if this is tru
Electronics Forum | Tue Dec 21 08:33:54 EST 1999 | Nancy V
Luis, Go to the library on SMTnet and you will see Standard and Terms. Select that and you will be able to download the terms and definitions for SMT assembly. It is very useful. Of the terms you requested, only FPY is not there. I was curious a
Electronics Forum | Thu Dec 23 16:56:43 EST 1999 | Wayne Norton
Am not aware of any resource which would accomodate your request, however we build contract boards for a number of communications mfgs. and use SMT in most of the applications with no problems. Have never had any functional issues brought to our atte
Electronics Forum | Wed Dec 15 09:47:31 EST 1999 | Wolfgang Busko
Hi Chris, the same reduction as for fine pitch (10-15%)has decreased the amount of solderballs enormously. Sure, with adequate pad design and good printing equipment and processcontrol you can get the same results but it does no harm as long as you
Electronics Forum | Wed Dec 15 10:47:57 EST 1999 | Christopher Lampron
I agree with Wolfgang. We are currently reducing appertures by approx. 10% even on the chip components. This still gives us an adequate fillet volume and very greatly reduces the probability of solder balling/beading. We generally refer to the manufa
Electronics Forum | Wed Dec 15 15:55:05 EST 1999 | Mike Naddra
As a general guidline I would agree with a 10% aperature reduction on chip caps , resistors, and fine pitch provided correct land geometries. When soldering to HASL surface finishes. Three things you may want to consider ; the stencil thickness, the
Electronics Forum | Fri Dec 17 01:21:54 EST 1999 | Victor Salazar
Weare using a Home plate design on 1210 or larger, 20% reduction on pkgs from 1206 to 1210, 10% reduction on 1206 or smaller, 0 reduction on all leaded components(sot-23, IC's) with a 6 mil stencil. For fine pitch we are using 4mil stencils. We h
Electronics Forum | Fri Dec 24 04:22:11 EST 1999 | Keith Stone
When you get to fine pitch you might want to try reducing the aperture on the long dimension of the pad only. If you reduce the width of the pad you can get solder paste left in the stencil giving insufficient or unsoldered joints. Reducing the lengt
Electronics Forum | Fri Dec 17 15:11:34 EST 1999 | Alvin Kevichusa
Let's look at it this way... Imagine a multileaded component sitting on a flat surface. If all the leads touch the flat surface, they are all in the same plane (that of the flat surface) and are coplanar. Coplanarity is desirable because if a lead is
