Electronics Forum | Thu Aug 01 07:52:37 EDT 2002 | GregH
Are all components calculated at the same cost when calculating cost per placement? Are they categorised according to their sizes / dimensions as per machine placement speed or are they also categorised as per component technology? Can anyone give me
Electronics Forum | Thu Aug 01 15:50:15 EDT 2002 | pjc
I had a 1995 SENSBEY MXL-400J at the last place I worked. I had very good results- easy to setup, run and maintain. It has a paint gun type spray head. Good idea to have spares cause they can clog. I sprayed a Multicore NC flux. Only downer was a fai
Electronics Forum | Thu Aug 08 15:16:03 EDT 2002 | OhioD
A "Pumpprint" stencil refers to a thick DEK stencil with pockets routed-out on the underside, so it will clear any THT leads, paste/glue deposits, etc., and not squish them. It's called pummprint because it was developed to use the ProFlow-type head
Electronics Forum | Mon Aug 05 03:03:50 EDT 2002 | jkhiew
Hi all, I had some old stock of CEM1 pcb: a. How long & under what temp. condition shall I bake it to eliminate the trapped moisture ? b. Is the baking time & temp. different for 3 yrs old stock, 2yrs old stock & 6 month old stock ? c. For CEM1 pcb,
Electronics Forum | Mon Aug 05 09:06:29 EDT 2002 | Adam
I'd like to ask for feedback on monitoring the reflow oven using a copper plate.Are there any articles relating to the above, in the sense of what size the copper plate should be, how many thermocouples should be attached, the frequency of measure me
Electronics Forum | Mon Aug 12 19:35:42 EDT 2002 | sleech
Been there, ... done that,...got the T-shirt. When with a major IC manufacturer, we tried this. IT DIDN'T WORK! The problem was that most convection ovens leak. We could not achieve a significant N2 atmosphere.Eventually went to vacuum-assisted bak
Electronics Forum | Tue Aug 06 22:20:32 EDT 2002 | Computer
Hi , I am currently faced with a problem with the via hole on the component pad. The customer does not allow plugging of the hole and enlarging the stencil pad hole size or thicker stencil size may cause bridging to the component next to it.
Electronics Forum | Mon Aug 12 12:58:16 EDT 2002 | pjc
What I've done w/ eutectic ball BGA devices is after removing the BGA from the PCB, solder-suck the lands- get em nice a flat, apply a thin coat of gel flux to the solder lands and then a thin coat to only the bottom of the solder balls on the new BG
Electronics Forum | Mon Aug 12 14:47:01 EDT 2002 | soupatech
Hi, Does anyone know the aprox. parts per hour a cp3 and ip2 should place assuming the program is optimized and everything else goes well (yeah right!)? I understand there are a lot of factors involved to get the correct numbers but what is the BEST
Electronics Forum | Tue Aug 13 10:08:44 EDT 2002 | dougt
Tony, I'm in Ken's corner.....the speeds the manufacturers offer are pretty much meaningless when it comes down to your particular board. Brand X can say they will do 1,000,000 cph but when you put your board on the machine with multiple parts at di
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