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Electronics Forum: forums/index.cfm (Page 4181 of 7890)

Solder balls

Electronics Forum | Tue Jul 20 02:36:03 EDT 2004 | yukim

Hi, The solder paste is SE5-M951X-9. Comparing with the previous one we used, we are having much more tombstoning problems. The reflow profile is such as: room temp to 140C: 85~95 sec 140 to 170 C: 80 sec 170 to 200 C: 20 ~ 23 sec Above 200 C: 44 ~

PCB material Nelco13 and FR4

Electronics Forum | Thu Jun 24 23:57:42 EDT 2004 | George

Could anyone tell me the difference in PCB material Nelco13 and FR4? PCB dielectric material Nelco13 is quite new for me and I knew nothing about it. For imcoming quality control (IQC), I am asked to identify PCB made of FR4 and Nelco13. How to do th

QC Job Definition

Electronics Forum | Mon Jun 28 22:26:25 EDT 2004 | davef

Probably every shop on the planet uses QC-types differently. They inspect boards for us, based on a sampling plan and work instructions for that board. When they find a problem, they put a little adhesive arrow on the board that points to the probl

Grainy Solder Joints

Electronics Forum | Fri Jun 25 13:25:04 EDT 2004 | russ

Sounds like the wrong reflow profile was possibly used on this batch, Or you have a lead solderability problem. Usually you will pull a pad off of the board instead of the lead out of the solder joint. When a lead is torn from the joint it will ha

Grainy Solder Joints

Electronics Forum | Fri Jun 25 14:39:59 EDT 2004 | Hoss

Any chance your potting compound was changed in the timeframe mentioned or the unit(s) were used under high heat stress conditions? If significant thermal expansion of your potting material happened and it is a hard durometer, it could shear at your

Flex circuits

Electronics Forum | Fri Jun 25 18:33:45 EDT 2004 | jsloot

We are doing what I believe is unique from everyone else. We are using a .010 thick flex circuit board populated with the usual components, sot-23, caps, resistors,etc. It is mountd to a carrier plate with the edges taped down but I am having troubl

Flex circuits

Electronics Forum | Fri Sep 10 18:17:21 EDT 2004 | jsloot

This is all very interesting. One obsticle I have to live with is I have an adhesive backing applied to the flex circuit before being placed on the pallet. Once gone through the reflow process the flex board goes through a couple of assembly stages a

DRY SOLDERNG

Electronics Forum | Sat Jun 26 15:20:56 EDT 2004 | russ

Are you saying that immediately after the initial assembly process the boards work and then after these same boards sit for 15 days they don't? If that's the case I would suspect contamination maybe. what type of flux are you using and what is your

BGA bake out....

Electronics Forum | Mon Jun 28 14:48:56 EDT 2004 | jdumont

Yes i was looking around that site this morning and found everything i needed. Thanks to all. Basically what im trying to do is justify the expenditure of a new NO2 generator for our IC cabinets. Ours died a little while back and we have been using

QS9000/TS 16949 Production Software Control

Electronics Forum | Mon Jun 28 09:56:03 EDT 2004 | John S

Our company is transitioning to TS16949 this year from QS9000. We've begun to wrestle with the subject of improving the control of our production machine programs without creating unneccessary signoff's/documentation. Does anyone have a suggestions


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