Electronics Forum | Mon Aug 13 10:00:18 EDT 2007 | ed_faranda
Might want to check to see if the weight of your part has increased. If it has increased, you may not have enough surface tension to hold the part on the board. I am assuming you already checked that the component isn't getting hit by something in
Electronics Forum | Mon Aug 13 11:05:18 EDT 2007 | saaitk
Would I be correct in assuming that the solder used to attach the BGA ball to the device body should have a higher liquidous point that the solder used to attach the device to the board. If the peak reflow temp for SnPb is around 225 deg should the b
Electronics Forum | Mon Aug 13 22:39:36 EDT 2007 | davef
The solder used to attach the BGA ball to the BGA interposer would have a liquidous point dependent on the type of solder used by the device fabricator. If this is a lead free device [altho we don't think so], the solder used by the fabricator would
Electronics Forum | Tue Aug 14 09:17:59 EDT 2007 | bpan
What version AP are you using? What version windows are you using? I think that the results you are seeing may just be a bug in the software. Did you try to export the programs and look at them on the machine in central controller? Its been a while s
Electronics Forum | Mon Mar 10 16:25:53 EDT 2008 | alsnet
No problem.....Any time. Hello Everybody, I'm looking for the AutoProgram Software for Quad IIc machine, Do you know someone who can share me a copy of this?, I can share a copy of the technical manuals of this machine. If you're interested, plea
Electronics Forum | Tue Aug 14 10:51:18 EDT 2007 | erhard
standard procedure for this would be to solder SMDs on the bottom side and the LEDs all at once on the wave - if the layout is ok for the wave. You would have to glue the SMD components, for this you would have to use a glue dispenser or a special hi
Electronics Forum | Tue Aug 14 15:08:32 EDT 2007 | gmoritz
pick/place head won't travel over the LED's, then you won't be able to proceed. I wasn't clear in describing my board layout; It is LEDs on one side and SMT components on the other side. I don't think we can get around the problem of stenciling
Electronics Forum | Tue Aug 14 16:23:31 EDT 2007 | stepheniii
I've never seen them used or even heard of them being used like this but you might want to look at http://www.sipad.com/ You will still have to work out other issues like how to keep the SMT on while you wave the LEDs. Maybe you can get these board
Electronics Forum | Tue Aug 14 16:50:43 EDT 2007 | rgduval
I see...said the blind man. If you've got the LED's on one side, and the SMT on the other...and you have the clearance, I'd go with the previous suggestion of gluing the SMT, and waving the whole assembly... As for stenciling....use a glue dispense
Electronics Forum | Wed Aug 15 08:49:46 EDT 2007 | mmjm_1099
All, I have a recent issue I would like some input on. It seems the picking of parts is off by about 2mm lately. The placing of the parts is fine it's just when it goes to pick we need offsets of 2mm for it to work. Someone leave me some feedback if
