Electronics Forum | Thu Apr 22 10:21:16 EDT 2010 | remullis
I am looking for anyone who has a C5 or equivalent that has successfully been able to pass large QFP parts that require 4 lead sets. The part I am working on is 31.75mm. The vision system takes four snapshots of the part and stitches the information
Electronics Forum | Fri Apr 23 14:27:22 EDT 2010 | hegemon
I am concerned about a 'tarnishing' effect after moisture bake out that affects solderability on a batch of PCBs. This finish is new to us,and I am wondering if anyone has ideas about how to drive the moisture out of the boards without compromising
Electronics Forum | Mon Apr 26 14:40:07 EDT 2010 | blnorman
We had one product that used immersion silver plating. There were a couple of instances where we saw tarnishing, and elemental analysis confirmed the presence of sulfur. These boards did have the anti-tarnish sheets between boards, but somehow they
Electronics Forum | Sun Apr 25 11:05:58 EDT 2010 | davef
Try: * Statistical Process Control for SMT; Dr. William Messina; Datasleuths; ISBN: 0967503396; 1999 * http://www.google.com/search?q=calculate+cp+cpk&ie=utf-8&oe=utf-8&aq=t&client=firefox-a&rlz=1R1GGLL_en___US374
Electronics Forum | Mon Apr 26 09:18:15 EDT 2010 | sudhir14
Hi, friends Need your urgent help on bellow issue ....... we are facing issue of misalign of one bulky SMT transformer during the placement itself rejection @40% & after reflow rejection @5 % using SMT m/c QP242 , placing this component at end of al
Electronics Forum | Fri Apr 30 00:20:33 EDT 2010 | sudhir14
We are using QP fuzi m/c during the placement of comp. PCB is fixed & placement head is movable This component is placed at last but still we are getting the problem Comp. is placed with slowest setting also slowest comp. transfer speed of nozzle h
Electronics Forum | Wed Apr 28 12:08:02 EDT 2010 | tjg
Our latest designs are flip chip on flex based and we have issues with delamination/blistering. We know it is related to our vapor solvent (n-Propyl Bromide based) attacking an inner layer adhesive. Has anyone else ever heard of something like this?
Electronics Forum | Mon May 03 20:54:06 EDT 2010 | aungthura
Thanks Josh for your kind advice. Yes, we have some contacts of Rehm vapor system.However, we didn't know about cost of galden what you mentioned.It is a good point and has been kept as a note and Electrolytics in Vapor phase,too. Hope you can share
Electronics Forum | Sun May 09 22:23:21 EDT 2010 | aungthura
Hi Josh yes, the cost of galden is a big concern because the machine should be run 12 hrs for 6days.Besides, we more concern in socket soldering by vapor because our socket can stand only for 30sec in 210'C temp.Meanwhile, we do socket soldering by w
Electronics Forum | Sun May 02 11:44:03 EDT 2010 | davef
J-STD-001 is your base requirement, but MIL and SPACE have stringent requirements for soldering gold plated terminals, e.g. this typical one: http://xweb.nrl.navy.mil/glast/CALDesign/CDE/CAL%20DPD%20Wire%20Cable%20Soldering%20and%20Staking%20Spec%20
