Electronics Forum | Fri Jun 07 15:49:44 EDT 2013 | emeto
We use Circuit CAM. It is awesome tool, because it give us the possibility to do the model for the job with all the data inside and from there we can create our documentation, pick and place, SPI and AOI programs right away, because Circuit CAM gives
Electronics Forum | Fri Jun 14 10:07:34 EDT 2013 | dontfeedphils
Thanks for the input everyone. I'm leaning more towards either Aegis or Valor. The other two cheaper (or free) solutions seem to work alright, but I also have a system in place that works "alright". Investing time in half-measures is always a hard
Electronics Forum | Fri Jun 14 10:47:57 EDT 2013 | jax
If you are looking into Aegis and Valor, you should also look at Optimal (Optelco), and Cogiscan. All 4 can do what you want and offer a growth path into Mixed Equipment Programming, Scheduling, Traceability, Quality Tracking, etc... Depending on y
Electronics Forum | Tue Jun 11 06:24:07 EDT 2013 | trottmann
thanks. 1. yes, i understand this requires SMT > assembly. > > 2. For bigger components (USB and > phone jack), how can these be placed > automatically on PCB? The manual process will be > slow. Hello, Use "THR Through-Hole-Reflow" also calle
Electronics Forum | Tue Jun 11 14:16:03 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Tue Jun 11 14:21:35 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Fri Jun 14 13:47:21 EDT 2013 | rway
Chances are this is not a component failure. First, these are passive components with passive testing on the ICT. He may have guarding issues, but more information is required as has been stated. Are all capacitors with the same P/N failing in dif
Electronics Forum | Thu Jun 13 12:28:41 EDT 2013 | kahrpr
18000 psi is what a injection molding machine can produce depending on the size of machine. When doing over-molding/insert molding the machines are a lot smaller less than 1000 psi and a lot of smaller items less than 500 psi. as far as Temperature 3
Electronics Forum | Wed Jun 19 06:59:43 EDT 2013 | rollon65
Hi Bobpan Thanks for the reply. I taught the reject mark but there appears to be no way to adjust the lighting for this purpose like there is in the fiducial teach screen. I have never accepted PCBs with X-outs before but agreed with my supplier t
Electronics Forum | Sun Jun 16 08:00:51 EDT 2013 | zaldytorres
Does anyone have suggestion how to modify radial insertion machine to 3.5mm pitch? I have to insert 3.5mm pitch Ecap but the industry standard radial machine could mount only 2.5 or 5 mm pitch. changing PCB or parts is not an option as it is not appr
