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Soldering Issue in Sensor component

Electronics Forum | Tue Dec 31 10:17:12 EST 2019 | emeto

Let's stay away from the PCB and process for a while. This component is pre-tinned. What kind of solder? How is the component stored? I bet you that you can put just flux on the board and solder this part - have you tried? I think we should understan

solder ball

Electronics Forum | Tue Dec 31 02:13:14 EST 2019 | agoesfirmanto

This PCB model has been in production since 2018 and stopped production almost 1 year ago, now it has started production again and I found this problem. at the time of production in 2018 this problem did not occur. while the parameter settings do not

solder ball

Electronics Forum | Thu Jan 02 07:04:57 EST 2020 | dontfeedphils

Pretty large solder-ball. Looks like it may have come from the ground pad since it's so large, in which case I would reduce the print coverage on the middle/ground pad and see how it works for you. You verified that these parts have the groundpad a

LGA voiding

Electronics Forum | Tue Dec 31 17:05:20 EST 2019 | slthomas

Assuming you've already looked at optimizing your profile and stencil design, have you looked at metal load in the paste? I hadn't, but just read that increased metal load (associated with reduced powder size, i.e., moving from T3 to T4) has been sh

LGA voiding

Electronics Forum | Fri Jan 03 10:32:42 EST 2020 | emeto

Zack, circles 36mil copper 35mil circle stencil aperture. Pitch is 80mil. Stencil is 5mil and apertures are spread 46mm under the 50mm component size. In my mind this might be too much paste. I am afraid that if I print 4mil I might get open joints

LGA voiding

Electronics Forum | Sun Jan 05 20:10:16 EST 2020 | sssamw

Yes, you may need tell us how the PCB designed, how it re-flow(even it's Indium voiding formula), how stencil is. The void ratio means area ratio, not diameter ratio, so you need calculate it. If you have high ratio void, show its picture.

LGA voiding

Electronics Forum | Fri Jan 10 03:57:37 EST 2020 | jakapratama

Hello, When I calculate based on the data you gave, your stencil aperture area compared to pad area is 94.52%. Your aperture area ratio is 1.76 using 5 mils thickness foil. OK, your stencil and your paste release is not the culprit here. Your proble

SMT line panasonic CPH target

Electronics Forum | Wed Jan 01 13:03:06 EST 2020 | ramsus

hello experts i want to calculate my target of cph i have a panasonic line composed of three machines 1.CM602L 4 HEADS 12 SHAFT 2.CM602L 4 HEADS 12 SHAFT 3. CM602L 2 HEADS 8 SHAFT + 2 HEADS 3 SHAFT Best regards

Benefit of GridLok screen printer ?

Electronics Forum | Mon Jan 06 16:58:45 EST 2020 | cbeneat

I would recommend quik-tool. Jim Bernhard essentally the inventor of Grid lok left when they went to DEK. Started quik-tool, we use grid-lok in our printers, quik-tool in our Panasonic P&P instead of support pins. Like quik-tool alot more. JBernhard@

Dek265 mk1 power problem

Electronics Forum | Mon Jan 06 11:41:52 EST 2020 | robl

JDT http://www.DEKHEAD.com if you are in the USA Adamtech http://www.adamtech.co.uk/contact.asp if you are in Europe There are some good Chinese suppliers, but a lot of Far East cards can be tarnished & with a reduced life due to running in a high h


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