Electronics Forum | Mon Jun 18 08:25:59 EDT 2001 | Carl Evans
The install of the new closed loop system is totally dependant on which m/c and levell of software you have. the maximum time it should take for a older m/c that has to have new wiring run in the m/c should take no longer than five days including tra
Electronics Forum | Fri Jun 29 13:54:43 EDT 2001 | Brian W.
I have had some conversations with MPM about the Rheo pump. They have some data to support the change from an ROI standpoint. One of their customers has seen a dramatic decline in the amount of wasted paste, resulting in a very large cost savings.
Electronics Forum | Wed Jun 13 17:50:06 EDT 2001 | deonn
Igmar, Have had similar problems in the past caused by different factors. The first obvious area to check is in your pick and place machine. Too much force in the Z-Direction may cause micro-cracks, which are not apparent, until the board is proces
Electronics Forum | Wed Jun 13 17:50:28 EDT 2001 | deonn
Igmar, Have had similar problems in the past caused by different factors. The first obvious area to check is in your pick and place machine. Too much force in the Z-Direction may cause micro-cracks, which are not apparent, until the board is proces
Electronics Forum | Fri Jun 15 13:06:15 EDT 2001 | CPI
I Agree with Dave, Check spec on cap some devices have temp constraints (can exceed x degrees for more than x time or can not exceed a certain ramp rate). Check that then go through the rest of the process chances are its not your machine if no other
Electronics Forum | Wed Jun 13 16:20:33 EDT 2001 | Gregory Stanton
Does anyone know of a quick method for developing reflow profiles for a Conceptronics HVA 102 reflow oven? Our plant is exceptionally busy and it's difficult to get access to the machine. I've been told by a few folks the oven has enough zones (7)
Electronics Forum | Wed Jun 13 16:58:26 EDT 2001 | Ken Lester
Greg; The universal profile concept maybe misleading. the main objective of a reflow system is to reach a certain temperature and maintain it for the required period of time. If your initial profile is set to accomodate this on any board the only va
Electronics Forum | Thu Jun 14 14:01:11 EDT 2001 | Claude_Couture
I used to associate the mass of the assembly with the reflow profile. The greater the mass, the greater the quantity of heat you need to give the assembly. Most of the time you just need to reduce the speed of travel in the oven. Try different settin
Electronics Forum | Tue Jun 19 13:28:41 EDT 2001 | drj
Greg: Several year ago we did a lot of work to develop methods for finding reliable common profiles. The process we came up with takes an emmense amount of time, and leaves the user with an "adequate" profile for each product, rather than the "one b
Electronics Forum | Thu Jun 14 00:58:06 EDT 2001 | plopez
Hello. We are a contract manufacturer that requires the removal of the green making layer on a PCB board. What we need to do is expose some of the conductive trace (estimated .025 length) to create a solder joint to a SMD. It sounds ridiculous, bu
