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Suitable temperature for solderjoint ?

Electronics Forum | Mon Nov 15 12:27:33 EST 1999 | Wolfgang Busko

Hello everybody, engeneering came up with following problem: Considering worst case the get a temperature at a component (Resistor 0805) of 109�C and 99�C at the solderjoints. As a rule of thump I said that the max. suitable temperature for the solde

Reflow Power Failure

Electronics Forum | Sun Nov 14 02:29:59 EST 1999 | Hany A. Salam

In our facility we face a lot of power failures due to the to the city electricity network problems.So, it has hppend many times to loose some PCA's inside the reflow oven. Of course it costs a big money tobuy a UPS for a reflow oven. One suggested

Re: Reflow Power Failure

Electronics Forum | Mon Nov 22 10:29:18 EST 1999 | Boca

Hany, Chartrain has some good points, if you product is expensive, what does the cost of a UPS amount to? Remember, you don't want to 'back up' the heating zones, just the controller and conveyor drive system so product doesn't get stuck in the oven

AOI

Electronics Forum | Sat Nov 13 08:16:16 EST 1999 | Chris Jackson

I am interested in discussing AOI. I am looking at introducing a system to a new SMT line. I am very interested in hearing from someone with MVP, MVT, Kestra, and CRTechnologies. The combo of x-ray and 2D inspecion that CRTechnologies offers is very

Re: patches

Electronics Forum | Fri Nov 12 10:36:33 EST 1999 | Dave F

Wolfgang: Sure, stacking chip components is common practice in prototyping, as you say, but it's not good practice for production work. Documentation: * ANSI-IPC-275 does not allow stacking * MIL-STD-2000A does not allow stacking * J-STD-001B is u

Re: patches

Electronics Forum | Sun Nov 14 11:45:08 EST 1999 | Jeff Ferry

Back to Wolfgang's original request. Stacking chip components is just one of many unusual mods that are being added to IPC 7711 Rework of Electronic Assemblies. While some may deem this technique unacceptable, it is a relatively common practices

Re: STENCIL CLEANING WITH SOLVENTS

Electronics Forum | Tue Nov 30 23:00:11 EST 1999 | Ricky L. Price

Bill S. is correct on the positive effects of the Smartsonic 440-R SMT detergent. We have been using this in conjunction with a Smartsonic 4200-2D ultrasonic washer that is equipped with a tank heater set at 100'F. Our suggested process window to p

Re: No clean and f devices

Electronics Forum | Thu Nov 11 18:28:10 EST 1999 | John Thorup

Hi Jeff Actually it's not necessarily Signal to Noise Ratio or even RF circuitry. All no cleans leave behind residue by description. This residue can affect RF or other high frequency circuits in a number of different ways including SNR. Very high

Re: No clean and f devices

Electronics Forum | Fri Nov 12 10:20:53 EST 1999 | Wolfgang Busko

Now an than I hear, read about the same thing but without mentioning specific frequencies. It�s something that worries me in the back of my mind but not in actual daily workflow. Our boards go up to 50Mhz with digital bus systems and are made with no

Re: Gold embrittlement

Electronics Forum | Thu Nov 11 18:39:06 EST 1999 | John Thorup

Assuming that you are going to solder them into a board rather than socket them, yes. The thickness of the gold plating in this application will usually make up a large enough percentage of the total joint to threaten enbrittlement. Use a small sol


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