Electronics Forum | Tue Sep 22 19:02:29 EDT 1998 | Matt
| DEAR SIR, | I WANT TO CALIBRATE THE RELOCATED THE WIDE WIDE & NARROW VIEW CAMERA OF FUJI CP-4-1 WITH SMD 3 VISION SYSTEM, SEEMS I HAVE /CAN CALIBRATE THE CP-4-1 WITH SMD 2 VISION SYSTEM ONLY. I BELIEVE IF THE VISION SYSTEM UPGRADE FROM SMD 2 TO SM
Electronics Forum | Thu Sep 10 22:33:24 EDT 1998 | S. Evers
| At the current time we are scoring and then | depanelizing by hand. Can anybody provide | info on other techniques for separating parts | from the panel? Thanks in advance. | Scott C. Something new that got its start in Japan is now being used fo
Electronics Forum | Thu Sep 10 16:15:52 EDT 1998 | Larry Johnson
I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the B
Electronics Forum | Sat Sep 12 20:28:29 EDT 1998 | Rick Bell
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Thu Sep 10 11:57:20 EDT 1998 | James Michaud
I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress reli
Electronics Forum | Fri Sep 11 00:52:19 EDT 1998 | Rick Thompson
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Thu Sep 10 10:07:46 EDT 1998 | J.H Kim
I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE mismatches, no leads for stress relief,
Electronics Forum | Wed Sep 23 11:50:34 EDT 1998 | Jeff Ferry
| Can anybody point me to a Standard that provides details on the use of Wire Links for the repair of SMT PCBs, e.g. the maximum number of permissible links, the material to be used, the method of joint etc.? At the next meeting of the IPC Repair com
Electronics Forum | Thu Sep 10 09:44:05 EDT 1998 | Earl Moon
| | Can anybody point me to a Standard that provides details on the use of Wire Links for the repair of SMT PCBs, e.g. the maximum number of permissible links, the material to be used, the method of joint etc.? | Dave: ANSI/IPC-R-700 answers many of
Electronics Forum | Thu Sep 10 17:26:56 EDT 1998 | Dave F
| | | Can anybody point me to a Standard that provides details on the use of Wire Links for the repair of SMT PCBs, e.g. the maximum number of permissible links, the material to be used, the method of joint etc.? | | Dave: ANSI/IPC-R-700 answers man
