Electronics Forum | Fri Mar 22 21:31:25 EST 2002 | ianchan
Hi Guys, Anyone have "comments/testimony" on having possible quality level achievements, for AQL=0.1, C=0 ??? Is this a realistic "1st Pass Yield" expectation? how about for OQC submission Lots from production? especially in a high-mix, low-volu
Electronics Forum | Sun Mar 24 23:11:36 EST 2002 | sy_koh
I am looking technology for BCC package. The preliminary datasheet from customer show that it had rectangular flat pad on the joint. The smallest pitch is 0.6mm having 96 I/Os. I am currently putting BGA, uBGA, CSP and CBGA onto PCBs usinf no-clean
Electronics Forum | Thu Aug 08 16:41:18 EDT 2002 | davef
On our last thing like that [5X5, 32, er 28?], we printed bumps on the QFN, but you can't do that, so there's no sense in tormenting you. Ideas that come to mind are: * Search around SMTnet for a paper by Chrys Shea on controlling dispense shots as
Electronics Forum | Fri Aug 09 11:59:31 EDT 2002 | bcceng
Tom, I developed a process for applying solder bumps on BCC32 and BCC48 successfully on my previous employer. The quantities were in the thousands a week, the following process is what I was using: Insert BCC's on process carrier (carrier holds 500
Electronics Forum | Thu Mar 28 08:27:56 EST 2002 | davef
Don't be concerned. Brian and Neil don't allow us to link directly to email from SMTnet [even though from the way the link changes color you'd think you could. They do this to subjugate the huddling masses and lord the power of cold fusion over us.
Electronics Forum | Sun Mar 31 22:50:28 EST 2002 | ianchan
Nope, we do not have solder beads, like we said, what we have are near perfect solder fillets except for the portion where the component is "floating OFF" the pcb pads. We are now mucking through the IPC-A-610C for specifications dictation on "tilted
Electronics Forum | Wed Mar 27 05:48:32 EST 2002 | ianchan
thanks for the opinion, dun think we want to drill the machine tables, due to SMT line config : 1) printer, 1unit machine 2) chip shooters, 3 units machine 3) IC mounter, 1 unit machine plus the potential void of machine warranty by the drilling,
Electronics Forum | Wed Mar 27 10:32:29 EST 2002 | barryg
hello evryone. I am rleatively new to smt production. Though we have been successfully running pcb assy's and getting very good solder quality we are trying to get some proccess control parameters set up for our printing process. We have a semiauto s
Electronics Forum | Thu Mar 28 14:04:16 EST 2002 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Sun Mar 31 10:03:25 EST 2002 | Bob
Cheers Dave, to answer some of your questions. � The component lead is copper with a tin / lead coating. The pads are standard Copper / Nickel / Gold. � The solder is standard Tin / Lead / Silver (2%) We have a lab that can determine the composition
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