Electronics Forum | Tue Jul 30 12:19:38 EDT 2002 | sueph
I am trying to get a profile on a thru-hole board with metalic coating on both sides. My preheaters are about maxed out and my profile is just reaching 200 degeres F. I'm not sure how much I can slow my conveyor down to get more heat. Does any one h
Electronics Forum | Wed Jul 31 17:57:11 EDT 2002 | davef
Foam fluxer, ouch!! That hurts. How about this? * Make a sheet metal box to cover your preheaters. [If your boss is really cheap, make a 'box' with 1/2" chicken wire and cover it with aluminum foil.] * Prebake the blank out of the boards, bag the
Electronics Forum | Thu Aug 01 10:09:31 EDT 2002 | sueph
Dave, I would have never thought of the sheet metal box. My west coast contact, who has dealt with this type of board before, told me yesterday to go ahead and try it at this profile anyway, as the metal plating holds more heat. I was pleasantly
Electronics Forum | Tue Jul 30 13:58:26 EDT 2002 | dragonslayr
To all SMTneters: I am seeking recommendations for software packages. I will be managing a Document Control Center for a Contract Manufacturer. I am aware of the functions, duties but do not know the commercial names of software needed. We will be ne
Electronics Forum | Tue Jul 30 20:32:39 EDT 2002 | YH Shiau
We look for a real-time X-ray machine with 90~100KV power to do the BGA/ FCCSP assmebly inspection. The key role for this x-ray will be defined as process control tool and PCBA level FA. VJ-1000 from VJ Electrnix is kind suitable for our needs. D
Electronics Forum | Wed Jul 31 06:50:10 EDT 2002 | mzaboogie
We have recently implemented a selective solder process using no clean flux. We have experienced a problem with "micro solder balls" Some of them are not so "micro". The equipment manufacturer stated that this is a common problem with no clean select
Electronics Forum | Thu Aug 01 07:36:03 EDT 2002 | pjc
Chris, OK, sounds like it may be more of an equipment problem: "The solder balls are randomly deposited along the path of the select wave,..." Does the equipment vendor have an applications engineering group to assist you? If not or are weak, try to
Electronics Forum | Wed Jul 31 14:08:22 EDT 2002 | Dave G
Used this paste on ENIG boards W/O N2 and had very good results. (0402's,BGA's,16mil FP) Never had the need to use N2 with this paste on our products. Running with N2 shouldn't hurt anything. The wetting properties should get even better than they ar
Electronics Forum | Thu Aug 01 14:24:11 EDT 2002 | gdstanton
We've been running Kyzen XJN+ with our new Westek Trek IV cleaner for months and have had few problems with ionic contamination. Prior to that we've used Kyzen products forever. Recently a Zestron rep did a sales pitch claiming a 50% savings if we
Electronics Forum | Wed Aug 07 05:08:04 EDT 2002 | matherat
This sounds like it could be a SIPAD solid solder application. Bring the boards in with the solderpaste already on them in a flattened solid form. Then you could print glue on them without disturbing wet paste. 1.Print glue. (Might take a little
