Electronics Forum | Mon Sep 23 20:00:21 EDT 2002 | kenbliss
Hi Reg We are not local to you, we are in California, but we can easily ship to you there. However we sell mat material in many types and sizes, cut to size if needed. We also offer trays for the mats for doing the type of work you describe. I do
Electronics Forum | Tue Sep 24 12:58:27 EDT 2002 | dragonslayr
Although focusing on solderability may be the right answer, I wonder if you are satisfied that co-planarity is not the root cause. With random events of contact opens, this may be the case. Cleanliness of the stencil can also be a source of your pr
Electronics Forum | Mon Sep 23 16:13:42 EDT 2002 | robf
Isn't this a blatant violation of rules? Couldn't Bill have e-mailed a response directly to the poster? I'm not sure if acts like this frustrate users that actually are the people who work in this industry but it definately frustrates suppliers who
Electronics Forum | Wed Sep 25 09:24:54 EDT 2002 | caldon
Michael- Please when concidering you U-sonic machine, keep in mind possible chemistries Petroferm, Kyzen, Aqueous technologies, and Zestron products. All are good products and all need to be evaluated with your stencils. Depending on your component t
Electronics Forum | Tue Sep 24 12:36:41 EDT 2002 | robf
But if the respondent could still click on the original poster's name he could contact him directly. If they are able to come to a conclusion between them that's great; if not, they could start a new thread and re-address the original or revised iss
Electronics Forum | Wed Sep 25 15:36:07 EDT 2002 | Jacob Lacourse
Hello all, our company is having issues with boards that are coming in warped. According to IPC-TM-650 it is said that one should use a flat plate when determining acceptability of warpage. What I would like to know is: 1) What should we be using
Electronics Forum | Thu Sep 26 11:04:34 EDT 2002 | mcmilse
This is a general question just to see what people may be doing to control the stencil printing process. I am new to the stencil printing process and as the subject line states I am looking to set up an SPC plan for my MPM UP1500. Now I have a few
Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.
unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-
Electronics Forum | Wed Oct 02 18:18:58 EDT 2002 | davef
The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This provides for setting your peak based on the
Electronics Forum | Fri Sep 27 10:01:25 EDT 2002 | stefwitt
chips up to 1411 ( I have not seen a 1411 component yet, but 1210 is a good number ) in 8 mm, IC up to SO8 in 12 mm, IC up to SOL 20 fit in 16mm tape. This is just a basic rule. You may also find SO 20 in 24 mm tape. More important is the reel width,
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