Electronics Forum | Fri Apr 06 08:35:20 EDT 2001 | brownsj
You can buy plenty of paste height measuring systems today, ranging from full 3D laser systems to systems using an oblique light line which will measure the paste height only. I found that the lowest cost option was to attach a DTI to the focus contr
Electronics Forum | Fri Apr 06 09:02:20 EDT 2001 | CAL
FYI- Toe Fillets have not been required per IPC 610b/c (they are nice to have though). Remember before Solder paste inspection equipment The Solder powder type/size, stencil type, and apertures are what defined volume. The need has not been until rec
Electronics Forum | Wed Apr 11 13:32:26 EDT 2001 | slthomas
I think we've miscommunicated....I don't use that thing for measuring paste height or volume as part of the process because it's not repeatable from one operator to the next. I use it more to measure radial tape and reel parts against EIA-486, actual
Electronics Forum | Thu Mar 29 12:25:19 EST 2001 | slthomas
All arguments about using OA pastes on high frequency boards to eliminate alledged RF interference aside, is it acceptable to touch up SMT components on these boards with a no clean flux cored wire after wave solder? All of our wave machines are usi
Electronics Forum | Fri Mar 30 11:02:58 EST 2001 | slthomas
Surprise, surprise. ;) Wouldn't think of it.... Yep. I'm not as concerned about two flux chemistries mixing and causing a substrate China syndrome as I am about the OA flux retained in voids and subsequently released in a touchup operation. If w
Electronics Forum | Thu Mar 29 15:50:35 EST 2001 | tomgervascio
We've think that with seen solder shorts under BGAs after wave soldering the boards. In addition, it seems to be related to a certain soldermask configuration over the topside BGA vias.. THere is one vendor,A, that is applying soldermask after HASL,
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Fri Mar 30 20:06:55 EST 2001 | aortiz
Maybe there's no test and I don't know where or why my customer came with that requirement (I think because in one of the board shipments he got a board were a smd resistor broke, but I think that happened because miss handling), but anyway I need so
Electronics Forum | Tue Apr 03 11:08:21 EDT 2001 | vsorin
Hi, Our engineering board has to decide which technology is better for the hand soldering of the SMT components: HASL or Chemical Ni-Au. We have an automatic line for SMD assembling and our experience shows us that for this automatic line is better
Electronics Forum | Thu Apr 05 22:24:32 EDT 2001 | davef
I think your solder mask is a partial cause of your solder balling. Additionally, adjusting some machine set-up parameters may also help. 1 If we were talking about a single assembly problem, we�d be thinking about the laminate, but since you say t
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