Electronics Forum | Mon May 24 09:33:27 EDT 1999 | Herb Pabes
| Hey peoples, | We are working with the dairy industry out here and they asked us to start reworking all there boards for them. Of course we said yes, hehe. Only we didn't know what them farmers coated them boards with. It turned out to be wax, h
Electronics Forum | Thu May 27 02:02:19 EDT 1999 | Earl Moon
| | Hey peoples, | | We are working with the dairy industry out here and they asked us to start reworking all there boards for them. Of course we said yes, hehe. Only we didn't know what them farmers coated them boards with. It turned out to be wa
Electronics Forum | Fri May 21 15:50:41 EDT 1999 | John Thorup
We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendors
Electronics Forum | Fri May 21 12:25:14 EDT 1999 | Dave F
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
Electronics Forum | Tue May 25 09:19:00 EDT 1999 | Ricardo Lopes
| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work
Electronics Forum | Fri May 21 10:39:55 EDT 1999 | Dave F
| I am looking for mfg's of "dishwasher" type circuit board assembly cleaning equipment. Does anyone know who makes them? | Try: Hotpack 800.523.3608 fax 215.637.0519 Tolis Vardakis x148 Unit Design714.282.8100fax8188 Dale Call Raygo, Powell OH 61
Electronics Forum | Thu May 20 15:13:50 EDT 1999 | JohnW
Folk's, One of my 'fellow' engineer's is brining in a new board that his customer has said shouldn't go over the wave..but he want's us to use intrusive reflow on a connector on the bottom side of the board..so since I was standing in the wrong pla
Electronics Forum | Thu May 20 11:55:04 EDT 1999 | Parvez
hi everybody, We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the micr
Electronics Forum | Fri May 21 14:22:56 EDT 1999 | Dave F
| Dave, | i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered
Electronics Forum | Wed Oct 03 13:48:42 EDT 2001 | rocco
hello every body !! We are assembling a new product with some kind of components like (soic)but this component has a metalic surface under the package that works like pin,is a ground terminal,and in the PCB you can see a pad, among the other pads,so
