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Re: Wafer Reflow Profile

Electronics Forum | Tue Feb 02 21:55:20 EST 1999 | Jon Medernach

Chris is correct. You will have a problem if you do not have the right metalization under your bump. The BM is critical, it is defined by the passivization layer on top of your die much like a solder mask defined interface on FR4. You will find mos

Re: Cracking solder joints

Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John

| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i

Re: Reliability data on pressfit rework/repair.

Electronics Forum | Tue Feb 02 10:12:50 EST 1999 | Justin Medernach

| Does anyone have any reliability data /concern on pressfit rework/repair - is there any qualified /characterized equipment /tools present in the industry? | What kind of effect does it have on barrel plating quality (1.5mil avg.) after 1 time rewor

Attenna assembly for RF board

Electronics Forum | Fri Jan 29 15:39:04 EST 1999 | Chris Jackson

I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the anten

Re: Attenna assembly for RF board

Electronics Forum | Sun Jan 31 14:03:41 EST 1999 | Dean

| I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the ant

Hi-Speed SMT manufacturing

Electronics Forum | Fri Jan 29 13:15:42 EST 1999 | E.

SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All parts for th

Re: White layer appearance on PCB

Electronics Forum | Thu Jan 28 20:00:54 EST 1999 | Dave F

| Okay, | | Another question, if the soldermask in not cured, then it is washed will water ingress (from wash or ambient ) play havoc with capacitance or dielectric of PCB. I mean will my crystal and clock circuits start "Y2K'n" on me. OR will my P

Re: white residue

Electronics Forum | Thu Jan 28 09:45:44 EST 1999 | parag

| | i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated tempe

Re: ESD Work benches

Electronics Forum | Wed Jan 27 21:31:46 EST 1999 | Dave F

| How ESD will be effected by painting the legs of the work stations. Any names of suppliers? | Ali: Wayne is correct that many of the suppliers of work stations are beginning to supply their product with ESD paint on the supports. On one hand,

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r


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