Electronics Forum | Mon Aug 24 07:12:20 EDT 1998 | Paul Horan
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Electronics Forum | Fri Aug 07 02:32:09 EDT 1998 | P.L. Sorenson - Technical Consultant
| | | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and
Electronics Forum | Tue Aug 04 12:32:13 EDT 1998 | Bob Willis
The design rules for solder thiefs are that the extra pads must be bigger than the proceeding pads to be worth while as a minimum guide the pad is 3x the size of the proceeding pad so if the pad is 0.030" the thief would be 0.090" wide. As steve has
Electronics Forum | Thu Aug 06 11:02:18 EDT 1998 | Jim Price
| | Dew: | | Is this the third or forth software alignment for Fuji? Hope they stick with Unicam for a period of time... | | Just my two cents.... | I believe it's the forth, MCS OS/9, MCXE,F4G, and now fujicam...were there any others I missed? | Pe
Electronics Forum | Mon Aug 31 10:28:11 EDT 1998 | Patrick O'Connor
| | | | Dew: | | | Is this the third or forth software alignment for Fuji? Hope they stick with Unicam for a period of time... | | | Just my two cents.... | | I believe it's the forth, MCS OS/9, MCXE,F4G, and now fujicam...were there any others I m
Electronics Forum | Mon Aug 03 22:00:50 EDT 1998 | Dave F
| I have some potential unused SMT equipment which may be candidates for sale. Any input regarding the value or expected going rate would be appreciated. | CONDITION: | E - Excellent Condition | F - Fair Condition | G - Good Condition | Equipment Li
Electronics Forum | Sun Aug 02 20:31:22 EDT 1998 | karlin
Hi Bob, The weight of the TBGA is heavier then PBGA due to the Stainless steel heat sink. I have tried run them through the oven without paste. Due to the high lead content( 90Pb/Sn10), the "solder: did not melt. Still see the misalignment issue but
Electronics Forum | Mon Oct 19 17:43:12 EDT 1998 | John Gregory
Ryan - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon Oct 19 17:45:25 EDT 1998 | John Gregory
Dave - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Wed Jul 29 17:39:40 EDT 1998 | David Spilker
| Hello everybody. | Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at
