Electronics Forum | Fri Sep 23 09:25:46 EDT 2005 | Base
Hey Greg, As you already pointed out yourself: unless you can do away with covertape pickup-spools (or can figure out a way to empty them without loosing tension on the covertape) your feeders will not be suitable for several consecutive splices. S
Electronics Forum | Fri Sep 23 10:25:40 EDT 2005 | gregp
On our machines, the feeder release latch is designed such that the feeder goes offline (machine will not pick from it) before you can actually remove the feeder. This makes it virtually impossible to damage a nozzle or spindle. I'm not sure about
Electronics Forum | Tue Sep 20 17:09:14 EDT 2005 | hly
I have a situation with hot boards with fine pitch BGAs that I need to build. However, there is a big problem--the auto screen printer is down. I decided that we would use the stencil and manually line up the pads and do a manual print. I can't ac
Electronics Forum | Tue Sep 20 17:38:59 EDT 2005 | kmorris
HLY: If you must build product while you wait to get the printer fixed, and if the BGA balls are eutectic solder, your approach is a good one. All solder paste does in this assembly application is supply the flux. Additional solder volume is not ne
Electronics Forum | Fri Sep 23 04:12:11 EDT 2005 | siverts
Installation/set up of the component shuttle is critical. The shuttle must be perfectly squared and leveled, since it has a 4 spindle pick/place head on it. This shuttle head can pick up to 4 comps. from the shuttle feeders (gang pick) and will deliv
Electronics Forum | Fri Sep 23 08:27:28 EDT 2005 | siverts
The 7 spindle Flex jet head, can only pick max 7 comps. from the GSM base machine in a single operation, not from the shuttle. The Flex jet head is faster in z-axis and will also use the OTHC (On The Head Camera) to inspect most of Your smaller comps
Electronics Forum | Fri Sep 30 03:36:39 EDT 2005 | pavel_murtishev
Good day, 2D inspection requires correct adjustment. In the other case it will cause continuous problems and false alarms. Adjust the lightning first and choose the correct process limits second. Look at histogram when you are adjusting the camera
Electronics Forum | Fri Sep 30 10:13:54 EDT 2005 | Cmiller
We are having a random problem with boards bowing significantly. Its a large through hole board with only one QFP on it. The bowing occurs during the SMT reflow. The only conclusion I can come to is a problem at the board house that made it. I just w
Electronics Forum | Mon Oct 03 22:24:57 EDT 2005 | Ken
How do you identify and segregate lead free boards in your factory? Example: Boards are colored RED or BLUE, bar code labels with symbology indicating Lead Free? I have a simple philosophy about this. Keep in mind I work at a High-mix medium vo
Electronics Forum | Thu Oct 06 09:11:14 EDT 2005 | russ
We use a diffrent colored traveller to identify the pbfree vs. other if you will. During our First article inspections we verify that the correct solder is being used per documentation and that the correct traveller is being used for that build. As
