Electronics Forum | Wed Jun 04 11:09:06 EDT 2014 | clydestrum
Ok, I have an issue that is somewhat uniform in it's recurrence in that it keeps showing up on the same location on the board. The problem area is a group of traces on the exposed side, that keeps having solder mask peel occur. As you can see in the
Electronics Forum | Fri Jun 06 13:03:01 EDT 2014 | asksmt
Hi All, i have footprint 2X5 RA HEADER 2MM spacing in design. I am using about 9 mils of annular ring on top side and about 12 mils of annular ring on bottom side. refer picture attached. we are having solder short issues during wave solder so was
Electronics Forum | Wed Jun 11 11:33:26 EDT 2014 | fredcalkins
I do not have machine experience, but I think vacuum too early would be a more likely cause of chips leaping to a nozzle. Juki nozzles are made of hardened stainless and could be slightly magnetic, but the end is relatively small and would not have t
Electronics Forum | Wed Jun 11 11:40:12 EDT 2014 | rgduval
As has been mentioned, it's likely that the component is moving in the tape, and flipping over. It is not likely that the pick/place operation is causing this. What I haven't seen mentioned is that there is an acceptability criteria in IPC for inve
Electronics Forum | Wed Jun 11 16:41:57 EDT 2014 | isd_jwendell
With Essemtec software you can specify to turn on vacuum once the nozzle is down at the part. The default method is to turn on the vacuum while the nozzle is up, but starting to move down. For light/tiny parts this can have the effect of making them
Electronics Forum | Mon Jun 09 14:09:06 EDT 2014 | jorge_quijano
Hola... I'm in the middle of a project to reduce assembly time in one of our products, this product has a lot of TH connectors to be soldered by hand, I'm implementing PHIR, first run has been completed, the appearance of the solder joints are obvio
Electronics Forum | Thu Jul 10 13:24:59 EDT 2014 | sargeredarmy01
Ok so here is where I am with everything. I pulled the cylinder and cleaned it out. Didn't find anything out of the ordinary inside. I set everything back up and tested it. Still nothing. I went into the I/O map and tracked down that input, I then
Electronics Forum | Sun Jun 22 13:24:49 EDT 2014 | davef
I don't know. We never had craziness like this before lead-free. You should have the yellowish-metal analyzed to be sure. Guessing: You're seeing this color on the terminations of components, not on the bulk of the SnX solder connection. If that's
Electronics Forum | Wed Jun 18 18:58:10 EDT 2014 | ke6zoy
Hi All, We leadform components for our assemblies in house and have been tinning the leads using a dip methood by hand into a solder pot. by just handling the components during the tinning and cleaning process we are at times damaging the parts/lea
Electronics Forum | Wed Jun 25 09:51:51 EDT 2014 | iam09
Hi Sirs, We are running Tin Lead process and we have boards that required clean and no clean process which have different flux application in our wave process. We are looking into opportunity to use common flux system for both clean and no clean an
