Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss
Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone
Electronics Forum | Wed Oct 25 12:24:02 EDT 2000 | Philip
Hi Chris! I hope this will help you! The CBGA uses an array of high melting point solder spheres(Sn10/Pb90) to connect its ceramic chip carrier to an epoxy glass (FR4) PCB using eutectic (Sn63/Pb37) solder joints at both ceramic and card inter
Electronics Forum | Wed Oct 25 10:11:09 EDT 2000 | Wolfgang Busko
Paddesign, aperture size and stencil thickness determine the amount of solder for your joint. Once you have found suitable parameters you need to control the volume of your paste deposit which is influenced by printer settings, paste condition, stenc
Electronics Forum | Tue Oct 24 12:20:35 EDT 2000 | JohnW
Adam, Did some work on this a bit back via some good old Taguchi DOE and like Dave(the guru)F say's your component terminations is a big factor but I also foundthat the amount of flux you put on as well as the preheat's has an effect, generally we f
Electronics Forum | Wed Oct 18 10:02:04 EDT 2000 | Jason Nipper
I know it's a tin residue because we have a Cheme in house who had a spectrum analysis performed in an outside lab. The waves parameters were out of control long enough to effect a number of units that are, we�ll can I say substaincial in a fiscal s
Electronics Forum | Mon Oct 09 09:56:11 EDT 2000 | John
I've run up against the same problem that I know many of us in the industry face; our management wants to obtain a "world class" level of production. This has come up before, and I've looked through several responses dealing with ppm (dpmo), failure
Electronics Forum | Mon Oct 09 17:49:29 EDT 2000 | sean
Hello John, The biggest stumbling block is going to be taking these responses and applying them to your assembly process much the same as trying to make other manufacturers' defect levels apply to your process. Ultimately, the overall quality of yo
Electronics Forum | Tue Oct 10 08:51:26 EDT 2000 | John
Thanks for the responses, and I tend to agree. I would much rather go through a more structured continuous improvment process (set goals, meet them, set new goals and so on). Our company is rather small and made the jump from all through hole to mi
Electronics Forum | Sun Oct 08 17:18:31 EDT 2000 | Scott
I have a problem, I have a radio control unit, which I need to power some low voltage lighting, the radio control unit is also used for two other items so I need to use it, the problem is that the current spike that is required when turning on the lo
Electronics Forum | Tue Oct 10 20:14:01 EDT 2000 | Dason C
Hi! CJ. Please advise what is your pitch size ie 15.7 mil or what is your capabiliy can you build the board with pitch 15.75 mil (please note that the actual dimension of the package is 0.4mm), and how many lead on the package. The pad width of Ind
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