Electronics Forum | Tue May 01 12:16:25 EDT 2001 | kaoni
I really appreciate your advice. Dave did not offer much in the way of real advice, his response was mostly diatribe. I am looking at visual inspection at this time as AOI might be overkill in my case. I believe that it, in combination with the machi
Electronics Forum | Tue Nov 28 14:31:10 EST 2000 | rabell
This is certainly an excellent question. We have shied away from going web based for several reasons: 1. Yes - bandwidth is a real issue. Research into instructional effectiveness of computer based training shows that students lose interest if res
Electronics Forum | Tue Nov 28 18:24:45 EST 2000 | rabell
When the original material was developed, we worked with a team of industry experts from a minimum of four different companies. The material was validated by them, down to the last test question. So this has not, to date, been a particularly thorny
Electronics Forum | Tue Nov 28 22:35:30 EST 2000 | rabell
We are currently in release 1.4 and 1.5 of the majority of our courses, partly because we do fix minor errors that do crop up, and release maintenance updates. I infer from your comment that you take exception to one or more of the test questions in
Electronics Forum | Tue Nov 28 12:00:33 EST 2000 | rabell
Deon, my first response is YES - big time. You are correct that there are some massive issues here. For one thing, lead free solders are only one solution, as conductive epoxy has also been put forward. This was demonstrated on the TAC line at Ne
Electronics Forum | Mon Nov 27 12:38:10 EST 2000 | rabell
There are a number of issues here. One is having good benchmarks prior to training. Most companies monitor production issues like inventory, scrap, rework, etc. A good ESD program would be performing frequent audits and recording deviations. Hard
Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc
Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can
Electronics Forum | Thu Oct 26 13:56:08 EDT 2000 | ptvianc
Hello: Pre-baking laminates should only be performed:(1) to meet contractual agreements or (2) in response to an actual defect that can be traced to PWB water absortion. Besides the fact that a pre-bake is an enormous process "bottleneck," it also
Electronics Forum | Thu Oct 26 12:56:50 EDT 2000 | ptvianc
That is a tough question. I think that an important point must be made, and that is that the electronics assembly business is just that, a business. And, electronics asssembly companies are in business to make a profit. The profit, or "bottom line
Electronics Forum | Thu Oct 26 13:10:48 EDT 2000 | ptvianc
Yes, one should always be concerned about "field failures" because they represent the point at which the product has exceeded its design lifetime with respect to its service conditions. Hybrid microciruit technolgy (HMC) has been around for a long t
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