Electronics Forum: found (Page 106 of 346)

SN/PB soldering with gold plated pcb

Electronics Forum | Tue Apr 26 11:22:48 EDT 2005 | denismeloche

I have found that Sn62 solder gives better strength and leach resistance when soldering to gold surfaces. The gold needs to be at least 5 to 10 micro inches thick to prevent nickel oxidation but if over 25 micro inches will cause brittleness. I hav

Flux residual on joints of PIH

Electronics Forum | Wed Apr 27 04:16:54 EDT 2005 | Bryan

Hello everyone, During our PIH process we found much flux residual around or on the joints of PIH after reflow.We use the Indium smq92j no clean solder paste.but the residual is too much to be accepted.can anybody share with me some ideas to solve th

green stick test

Electronics Forum | Mon Sep 12 13:31:11 EDT 2005 | stepheniii

Are there any write-ups anywhere? My boss wants to show a customer a write-up. I"m checking IPC specs but havn't found anything. I think almost everyone does it but is not a published standard test. I hope some organization has written it up as a st

Circuit cam related software

Electronics Forum | Mon Jun 06 15:55:44 EDT 2005 | avalancher

Please also consider that Aegis also offers the Xtra-Net interaction software. I'm unaware if any of the other products offer this. I had a problem with one job I was working on. I called Aegis, he connected to my computer directly while talking to

Solder Wetting Problems, Need Referee's

Electronics Forum | Tue May 31 10:44:16 EDT 2005 | Scott B

We have found that when the HASL thickness is less than 5 microns the tin in the HASL reacts with the copper leaving a SnCu surface with poor solderability and microscopic grainy Pb islands. The IPC does not specify minimum HASL thickness but we now

fine pitch QFP

Electronics Forum | Thu Jun 16 08:31:15 EDT 2005 | jh0n!

The most part I have the most difficulty with is a 16mil QFN. We found that reducing stencil thickness to 4mil, and reducing aperatures for the IC by 20%, and setting local fiducials to the IC helped immensely. We used to get 75% or more bridged ou

How to improve the solder quality of QFN?

Electronics Forum | Fri Jul 15 13:58:32 EDT 2005 | seaK

Our production is putting QFN40 and QFN56 package on board. With 80% opening on terminal, 40% on thermal pad, we found QFN56 100% forming toe fillet, but it does not work out the same to QFN40. We suspect it's because of the weight of component.....

Pick and Place drops nozzles

Electronics Forum | Tue Jul 05 10:27:34 EDT 2005 | GEB

The nozzles are brand new too (got them friday). 08MPF (0.08") is their part number. I tried using the air kiss feature in the setup mode and found that it blew the nozzle off the nozzle holder, not sure if this is ment to happen in this mode, but t

Cu dissolution PTH

Electronics Forum | Wed May 03 15:16:59 EDT 2006 | patrickbruneel

Great to see you have found a solution because now it looks like the component manufacturers will take their share of copper to. Look here http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=10308&mc=2 Inds you have an

soldering irons for lead free

Electronics Forum | Tue Jul 12 08:44:58 EDT 2005 | jdengler

JBC is offering "Lead free" tips now. They have this on the web site: "JBC recently released a new series of tips featuring a thicker iron bath that we find more resistent to aggressive additives and flux as found in lead free alloy." We have not d


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