Electronics Forum: found (Page 111 of 346)

Dross Eliminator

Electronics Forum | Thu Aug 10 00:07:08 EDT 2006 | John Erickson

I paid $168/ liter for the leaded on my recent order of 24 liters. They claim each liter converts 100 lbs of dross and we've seen that to be pretty accurate. So 1 liter @ $168 or 100 lbs of solder for $400. I liked the fact that you start to save wit

Dross Eliminator

Electronics Forum | Mon Aug 14 13:21:32 EDT 2006 | John S.

We've just conducted an MS2 study, and we found very little improvement. We run N2 inerted contour waves (E-vert). It seems that if you use N2 and a dross reclaim agent (Kleenox) then you may not see as much improvement. What types of waves are yo

smt rework

Electronics Forum | Mon Dec 04 16:55:58 EST 2006 | Rog

Hello Dougs and Steve (the message before) I am the R from PDR. Sitting here in England browsing. Thanks for your comments. In the end, all the technologies work to some degree...but as you have found out, we have some good points. It has been 20 ye

Help identify missing smt component

Electronics Forum | Tue Aug 08 17:15:16 EDT 2006 | Ron

That's exactly what I thought but needed a second opinion. I found a part that matches the size, dimensions and two coil but am unsure which impedance it would be. http://www.bourns.com/pdfs/pm0805cm_pm1206cm.pdf Thanks for your input!

Found Ceramic Chip Caps to be Short Circuit

Electronics Forum | Thu Aug 24 17:29:02 EDT 2006 | GS

Also, Make sure the Caps are suitable for Reflow temperature. It may be they are suitable only for wave solder temperature (ie. Murata capacitors can be: GR..... only for Wave Solder GRM...... can withstand Higher Reflow temp...) Several years ag

Auomotive: Conf Coating

Electronics Forum | Thu Aug 31 15:56:12 EDT 2006 | GS

Many thanks Saaitk, The PCB to protect could be (fuel cut off control system against tiefs ...)located in between driver cabin and engine. I have done a quick look on HumiSeal Automotive Products, found Acrylic Resin, Model 1B66 should be a suitabl

Bga failure

Electronics Forum | Mon Oct 02 19:04:53 EDT 2006 | DC

We had a issue on the SBGA and found stress built up at the corner of the SBGA after cool down to room temperature. It is confirmed by the warpage analysis. I expected that the stress caused by the heat spreader and the epoxy to the copper frame. O

Local Fiducials

Electronics Forum | Thu Oct 19 12:18:46 EDT 2006 | curious

Maybe I'm missing something here (we don't use locals and have never found them to be helpful, Panasonic and Fuji) but the fid coordinates don't necessarily have to be the same position in relation to the part placed. If you can use global fids. (whi

Flux residue cleaning procedure

Electronics Forum | Sun Oct 29 22:41:29 EST 2006 | hanocete

We have a current problem on our packages after we bake it for 24 hrs prior BGA rework. Flux or white residues found on the connector leads and terminals that cause not contact problems during mating. Could you help us how to clean the fluxes properl

IR zone vs forced convection

Electronics Forum | Mon Oct 30 09:43:31 EST 2006 | russ

Are your preheaters maxed out then? What is conveyor speed? anyway I would not have issue with that configuration at all. I have actually found that when using convection for some watersolubles you actually dry out flux and performance is worse.


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