Electronics Forum | Tue Jun 04 11:14:48 EDT 2002 | ckd
Hi All - My question is how do solder balls form and stay in the vias? The assembly goes thru SMT top placement, reflow then thru hole components mounts on top side as well. The board is sent thru the wave solder process. Has anyone experienced this
Electronics Forum | Mon Jun 17 13:07:11 EDT 2002 | Robert Hartmann
Can anyone point me to a specification or paper describing the existance of voids in transfer mold epoxies during CSP assembly? We have found very small bubbles in our process, but cannot find any information as to whether this is acceptable, and if
Electronics Forum | Tue Jun 18 20:14:14 EDT 2002 | mantis
Well if the Part Data isint correct then your placement position wont be right especially if there odd for connectors.You should examine the image on the ip3 and determine wether the machine has found the centre of the part.Also u might want to check
Electronics Forum | Mon Jul 01 22:24:10 EDT 2002 | Por
Thanks for your advise Normally, We do not add any liquid flux (clean or No-clean) during touch up process but this case is an error. Lonco 23F is Nc flux. but our board is clean. However, there are 6 boards that found the white residue and our
Electronics Forum | Mon Sep 09 17:45:33 EDT 2002 | slthomas
Around here that opens you up to some financial liability if ANY lead is found in the sewage, if they can't pinpoint the source. Every user over X lbs./month (dunno the specifics, just got this from our hazmat guy) is on the bubble for anyone else's
Electronics Forum | Wed Sep 11 12:52:14 EDT 2002 | slthomas
We have found that using the SPC capability of the profiler's pc software helps us identify oven malfunctions sooner than we would normally find it. The ovens tend to compensate for dieing or dead blowers by cranking the heaters on for longer cycles
Electronics Forum | Sat Sep 21 23:38:06 EDT 2002 | ivanchu
I got one problem from my production line recently. One 0.5mm pitch QFP IC have been used on my PCBA. Actually, the defect was happened in randomly. Sometime, we got the fillet completely but sometime is not. The solder joint look like is good, but t
Electronics Forum | Wed Oct 02 11:44:58 EDT 2002 | slthomas
We found that a slightly more active flux was all we needed to provide sufficient wetting on the one AgPd part we put down. Unfortunately the paste we tried also slumped terribly, so we nixed that fix. It's a low volume product (50, once every 3 mo
Electronics Forum | Mon Oct 21 03:52:38 EDT 2002 | Ben
I'm doing lead-free SMT of BGA with 450 micron ball. I found there are lots of voids under xray, there are around 2-3 voids in every balls. It is around 10% of volume ratio. I would like to ask if anyone know there is any standard of acceptable maxim
Electronics Forum | Thu Nov 21 01:01:33 EST 2002 | chao liang
Who had building the f4g and c/c server , when I set up the f4g and the c/c server I found them could not transportion , The FTP could work in normal ,the error code is 417c0021 :c/c connection to failed ,[cann't connect local socket [ connect :10060
