Electronics Forum | Fri Sep 14 15:23:41 EDT 2001 | davef
I saw your earlier postings on the topic, but am not familiar with Print Pro-E Drawings. Have you tried the common Gerber viewers? Like: * View Mate (View only) - http://www.lavenir.com * CamCAD (View only) - http://www.camcad.com * GC-Prevue (View
Electronics Forum | Sat Nov 03 05:19:59 EST 2001 | Ben
Hi I have question about thermocouple type use for Super M.O.L.E. I found in some article that type K T/C (Nickel-Chromium vs. Nickel-Aluminum) may suffer from temperature cycling hysteresis at above 250 degree C and also diffecult to solder. Now
Electronics Forum | Fri Dec 07 15:23:27 EST 2001 | davef
I'm with Brian. TIN COATED 0603 FAILURES Welcome to the lead-free generation. ;-) The Eurolanders are so blanking stupid, it just makes my head hurt. But then again, it doesn�t take much. OK, enough pontification. Your profile is setup incorrec
Electronics Forum | Fri Feb 01 06:15:46 EST 2002 | nifhail
This can be a solution for IC/BGA soldering for lead-free process isn't it ? See, most of the reflow profile set meets solder paste specification but often violating ICs or BGA requirement. Most of the solder paste required temperature of about 205 -
Electronics Forum | Wed Jul 03 10:34:35 EDT 2002 | davef
Suggestions are: * Convince yourself that your paste printing and paste control processes are in control. * Convince yourself you oven is in-control and capable. * Get one of those FREE software packages from the profiler companies [ie, KIC, ECD, etc
Electronics Forum | Wed Nov 20 18:41:57 EST 2002 | slthomas
Here's part of what I could read: "We evaluated the influence of Lift-off (Fillet-lifting) and the influence of thermal fatigue, in this case on combination between various terminal platings of electronic components and Pb-free solder, Sn-37Pb solde
Electronics Forum | Thu Nov 21 06:36:30 EST 2002 | Ben
I'm doing SMT of lead-free solder BGA on FR4 Ni-Au PCB. The solder paste I'm using is Sn/Ag/Cu and reflow with peak temp at 240C. I found there are voids(1-2) in almost every solder joint(500 micron in dia) under xray. And the void size is violate th
Electronics Forum | Mon Jan 13 17:50:54 EST 2003 | jonfox
I was looking for some good documentation that could nail down some pros/cons of voids, but haven't found any. The biggest issue is if you are going to temp cycle the chips/PCB after assembly. Depending on the cycle, the situation of the test, it c
Electronics Forum | Wed May 07 09:21:46 EDT 2003 | davef
Here's some papers: * �Voiding Of Lead-Free Soldering At Microvia�; Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee Indium Corporation of America; SMTA International; 09/22/2002 * �Solder Joint Formation With Sn-Ag-Cu And Sn-Pb Solder Balls And Pastes�;
Electronics Forum | Tue Jun 03 12:24:50 EDT 2003 | blnorman
I have received information from the European Commissioners Environmental group that automotive electronics are not covered by WEEE (waste electrical and electronic equipment 2002/96/EC) or RoHS (reduction of hazardous substances 2002/95/EC) because
