Electronics Forum | Fri Aug 19 08:32:54 EDT 2022 | angela t
The GKG G5 press has occasional drive alarms, sometimes it turns off and restarts, sometimes it needs to be unplugged from the board cable at the back and the alarm returns after a period of production. What is the problem? Could any of you give me a
Electronics Forum | Sun Jan 05 05:14:00 EST 2020 | gaintstar
Automatic Stencil printer, I suggest GKG G5 printer, price 20000USD and best quality in the world, sold thousands set already. please contact me by email email@example.com for more information.
Electronics Forum | Fri Aug 26 01:46:04 EDT 2022 | angela t
The drive and power supply were checked and were fine, but later I found that there was a problem with the J22 cable, which would alarm if I touched it. I suspected that the cable was damaged and planned to buy a replacement cable to try.
Electronics Forum | Thu Oct 13 03:02:01 EDT 2016 | souldierann
I hope you could able to help me how come the fuse blown out when we powered up the board containing relays. The relays rated current is 80milliAmps only compared to the 2A fuse.The relay contact form is SPDT.
Electronics Forum | Fri Mar 13 17:09:49 EDT 2009 | kmorris
We have found very small solder deposits on the gold fingers of some PCI boards after assembly at our CM. In the IPC-A-610, it says that no contamination or solder is allowed in the critical contact area. 1. I'm looking for feedback on what others
Electronics Forum | Fri Oct 14 11:51:57 EDT 2016 | davef
As you imply in your question, it's counter intuitive that a 2A fuse would blow before an 80mA relay circuit activated in the same circuit. Assuming the 80mA relay circuit is a protection circuit. There's maybe 100 different design goals [ https://bo
Electronics Forum | Wed Jul 18 08:00:48 EDT 2001 | davef
250C flass transition temperature - M = coloring agent or opacifier added to F resin with 110-150C glass transition temperature - N = natural color of resin - P = coloring agent or opacifier added to resin - T = natural color F resin blended with
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
Electronics Forum | Wed Oct 17 17:36:32 EDT 2018 | davidsmullins
Thanks for all the input! I should clarify a couple things. We are a contract manufacturer; we simply build to our customer's design prints. This particular board, we outsourced because of some requirements for processes we don't do in-house. So, we
Electronics Forum | Mon Jul 05 18:40:24 EDT 1999 | JohnW
| Dear All, | | We are a medium sized Electronic manufacturing company manufacturing computer motherboards and Telecommunication products. We have a big debate going on within our company regarding the defect rate measurement technique. | | At p