Electronics Forum: get (Page 1141 of 1323)

Looking under a BGA

Electronics Forum | Sat Jan 08 11:12:49 EST 2000 | S. Evers

Hi all, Best Thing Since Sliced Bread? No doubt many of you have seen Phil Zarrow's "over-the-top" review in Circuits Assembly of the new Ersa scope, a device that allows viewing a really neat close up a side view of the component substrate interface

Re: Looking under a BGA

Electronics Forum | Wed Jan 12 20:20:54 EST 2000 | Bene

I had the opportunity to spend time with a demo and one on one with the inventor of the Ersa scope inhouse a few months ago. I see the scope complimenting X-ray inspection but not as a substitue. It allows you to view attributes of a solder joint t

Re: BGA reflow profile

Electronics Forum | Tue Dec 28 12:55:16 EST 1999 | Justin Medernach

Greg, The best advice that I can give you is a PBGA will respond just like any other surface mount package. There may be a 5 degree delta between a PBGA 356 and a QFP208 but the two respond very similarly in the convection reflow environment. CBGAs

Re: Laser Marking using 2D Matrix Code

Electronics Forum | Fri Dec 17 09:47:10 EST 1999 | John O'Brien

Chuck: Your best resource is the Symbology Research Center in Huntsville AL. In is a research and development facility run by RVSI Acuity CiMatrix, the folks who invented the Data matrix (DM) 2-D code. This facility is unbiased as to technologies and

Re: un-tested assembled circuit reject rates

Electronics Forum | Wed Dec 08 02:07:25 EST 1999 | Scott Cook

Tim, What Brian writes is all true. However, let em put it into a sales / marketing perspective..... The REAL issue in your situation is: Who is responsible for the failures which WILL result in shipping untested product? Typically, your customer

Re: Noclean soldering to gold

Electronics Forum | Mon Dec 06 03:54:57 EST 1999 | Chris May

Hi Russ, I have a similar situation. I have been told that this can be caused by the nickel, over which the gold is plated, can result in suspect joints, embrittlement etc. Some joints can even be weak and broken without much force on some of my boa

Re: In House or Out

Electronics Forum | Wed Dec 01 13:19:52 EST 1999 | Wolfgang Busko

Hi Dick, first of all I will not judge what�s the best in your case for I don�t know all details of your situation. Just my opinion: As a matter of fact the amount of THT is rapidly decreasing compared to SMT. So, to stay in assembly business it vita

Re: SMT Zero-defect Soldering

Electronics Forum | Wed Dec 01 22:34:32 EST 1999 | Dave F

Mark: Ralph Woodgate is a "god" of solderability control programs. We have: � Been attending his seminars for, maybe 8 to 10 years ... who keeps track when you�ve been breathin� fumes that long? � Three different editions of his "Handbook Of Machi

Re: copper land delamination

Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F

Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l

Re: Dull Solder

Electronics Forum | Fri Nov 12 08:55:43 EST 1999 | Wolfgang Busko

Hallo Edmund, what does dull mean in your case ? It�s nearly impossible to say something about it without more information. Dull or shiny isn�t a clear or better no indicator for good or bad. Some companies add other metalls to the solder to get rid


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