Electronics Forum | Thu Jan 18 09:54:22 EST 2007 | SWAG
Thanks for your advice, all. We do not use tooling, Pavel. We requested a board thickness change from our customer - it turns out that the unusual thickness was designed for mechanical fit-up only and this thickness is no longer a concern as the as
Electronics Forum | Wed Jan 03 23:00:18 EST 2007 | new guy
I'm a new guy in this field. I have a question about solder paste process. Is there any effect to the solderbility if we do a lot of contact to copper pad without using any insulation ( direct to the finger ). Where can i get information about smt pr
Electronics Forum | Thu Jan 04 15:04:30 EST 2007 | samir
*SCOFF*... *GUFFAW* Any "literature" that you get saying that RoHS is actually BETTER for the environment, is probably "all made up" with fake data, charts, graphs, etc. (a fat guy once told me that, that's all I know how to do..make fake data, ch
Electronics Forum | Fri Jan 05 20:12:22 EST 2007 | engr
I am using PWB material Rogers 6002 High Frequency Laminate. The PWBs are assembled. They were washed and will require a bake out. Some people say, no bake out is required for the material. I am getting different reads in test if the CCAs are not
Electronics Forum | Tue Jan 09 08:26:51 EST 2007 | stepheniii
If your boards are not totally rectangular part of the board can stick out past the stopper. If the fiducial is there then you can't use it. Also make sure you are not using panel fiducial co-ordinates and then expanding those out with panelization
Electronics Forum | Tue Jan 09 22:16:17 EST 2007 | guest
For chip components it is very hard to identify specially the capacitors. You could get sample of each chip manufacture and compare the color. This is very labor intensive task. I suggest to sort by value ( capacitance, resistance) than by manufac
Electronics Forum | Thu Jan 11 16:01:52 EST 2007 | russ
You using lead free BGAS now? What is your rework equipment and process? I am sure we can help you out here with some more detail, you should get the package data sheets for your problem BGAs and determine ball alloy or they may even be CCGA packag
Electronics Forum | Tue Jan 16 15:42:45 EST 2007 | slthomas
Now yer talkin'! FTR, I've seen 7 month old (5 month shelf life in a 45� F fridge) WS based pastes in tubes turn to clay and refuse to print through anything less than about 50 mil pitch. This was stuff stored in the fridge per mfr's spec. I suspe
Electronics Forum | Thu Feb 08 15:05:32 EST 2007 | realchunks
Wow, what a bunch of crabby old men. BGA opens can occur from pre,during or post process. I never chimmed in cause the original poster said they would performa a dye test. Yet as usual, they never get back to this forum on what the cause was. So
Electronics Forum | Wed May 02 11:00:46 EDT 2007 | bartlozie
to get a 0-defect layout, OEM and CM have to work together, If you know what connections (balls) are the problem ones, let me know, and send me the gerber-layers + solderpaste layer, so we can see if the problem is design related or if you CM realy
