Electronics Forum | Thu Sep 23 13:14:22 EDT 2004 | Bob R.
We're just getting started in lead free, but the solder balling and poor wetting sounds like what we saw in some early experiments where we were investigating whether we needed nitrogen. Without nitrogen inerting we got just the kind of things you'v
Electronics Forum | Thu Sep 23 14:58:50 EDT 2004 | C Lampron
EMS-Engineer, Lead free alloys have a very low wetting creep. You probably will not ever get the same type of weting with a LF as opposed to SN 63/37. The question is if it is acceptable. Lead free solder joints cannot be inspected to the same crite
Electronics Forum | Fri Oct 01 13:37:27 EDT 2004 | rkevin
Well Thanks for all the good advise. Lots of different opinions on this one. I took the advise to contact my current supplier of solder paste. They sent in one of their tech people along with a sales guy and we ran without much trouble. Other than a
Electronics Forum | Sat Sep 25 10:36:06 EDT 2004 | gpaelmo
Hi, Anyone using this in production? Our company is looking into this model (used). Board size up to to 8"x10", max layer=12, single and double side SMT, medium density mostly passives, max QFP/BGA on board=7-10, 1,000-3,000 boards/wk. Can anyone d
Electronics Forum | Mon Sep 27 15:25:55 EDT 2004 | HOSS
JD, Have you considered manual dipping? For that low of a volume, the purchase cost and maintenance wouldn't seem economical but I'm not in your shoes. With hand dipping, you don't have the thickness control you may need but it can be done. If yo
Electronics Forum | Sat Oct 02 06:14:19 EDT 2004 | goofy
Yes! I now it is a simple question! Can you place audio information on to a mobile phone simm card which you can be play through the phone when you press a key. Example: I place my new simm card into my phone, then the display will change on the phon
Electronics Forum | Tue Oct 05 17:37:21 EDT 2004 | mikecollier
We currently use a KIC 2000 system to profile on our oven and create our recipes. I had a customer in today reviewing our profiles, and he had concerns that we were exceeding 4 deg. c/sec. on our profiles. The process window parameters that we use
Electronics Forum | Tue Oct 19 13:03:16 EDT 2004 | pjc
Electronics manufacturing moving to China is not about the labor man. You all don�t get it. It�s the material, and not just the electronics material either. Plastics and metal parts costs are lower. Labor costs are the smallest component of a produc
Electronics Forum | Thu Oct 14 06:27:45 EDT 2004 | davef
a disturbed solder joint. * Extended/slow cool down ramps can result in surface texture => grainy solder joint. Second, the "BGA scaling" could be a reflection of: * Too little heat (incomplete solidification) OR * Too much heat (excess grain growt
Electronics Forum | Fri Oct 15 09:11:39 EDT 2004 | mattkehoe
Hi Justin, Thanks for the feedback. We are inspecting with the naked eye. Most of what we do are prototype quantities, in this case 6 pcs, so AOI or measurement equipment has never seemed justified. The release looked uniform during the printing a