Electronics Forum: get (Page 851 of 1323)

Re: Iron Tip Temperature Profiling

Electronics Forum | Thu Nov 11 10:49:13 EST 1999 | John Thorup

Hi Jim All the major players make soldering iron testers that will test temperature, stability, ground leakag and other parameters. WellerWA2000 Hexacon G210-G310 Edsyn MS410-MS412 Bonkote MCA700 Pace P/N8001 and others There is no particular reason

Re: paste release from stencil, and volume calculation

Electronics Forum | Tue Nov 09 17:12:38 EST 1999 | Dave F

Steve: Addressing your points: 1 FINE PITCH APERTURES Electropolishing Laser Cut Stencils: Laser cut should not requiring polishing. Geesh, how much money do you have for stencils? ;-) Oval Shaped Apertures: Pass. What do you expect to gain f

Re: paste release from stencil, and volume calculation

Electronics Forum | Tue Nov 09 19:45:48 EST 1999 | Steve Thomas

1 Money IS an object, and my boss will be thrilled. The stencil manufacturer recommended ovals to facilitate better release. Seems likely to be true, but whether or not it's necessary I don't know. We have perpendicular walls on these (6 mil) ste

Re: Polarity of parts in packages

Electronics Forum | Thu Oct 28 23:45:23 EDT 1999 | DGrenier

JC: Seen this before, many times. We fixed our problems at the co I work for by giving a packaging specification to our purchasing dept. Took some work but the payoff was pretty big. This document includes such things as orientation,pitch,tape type

Re: ESD mats

Electronics Forum | Wed Oct 27 17:27:58 EDT 1999 | John Thorup

well... it might be cheaper. But I think it's a bad idea. First, your operators will hate you by the end of the day with their sore feet, not to mention lost productivity. Second, safety. Even if the plates are connected to ground through a resistor

Re: ESD mats

Electronics Forum | Wed Oct 27 22:58:56 EDT 1999 | Jeff Sanchez

Hany, John is right! How do I know cause I have a metal wire floor. I was faced with the same problem you are faced with now and the price was up there. I had one advantage, My floors where raised wood when we got the shop. This reduced the fati

Re: Wave process w/Alpha Metal 310M

Electronics Forum | Tue Oct 19 14:56:55 EDT 1999 | JohnW

Nick, I've run this flux for a while and it's not too bad. There is a tendancy for there to be residue left on the PCB after wave due to the solid's content but it can be minised by putting some effort into setting up your spray fluxer to an optimum

Re: Top Side BGA Reflowing @ Wave Solder

Electronics Forum | Mon Oct 11 08:34:52 EDT 1999 | C.K.

Thanks for the acvice, Dave and John. Like I stated above, I didn't feel comfortable with changing wave parameters since I knew that we'd be compromising our wave quality. I'll try the peelable mask thing, reprofile, and let you guys know what i fo

Re: help help! Water clean for CSP/BGA package

Electronics Forum | Tue Oct 05 06:03:37 EDT 1999 | Graham Naisbitt

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

Re: Cost per placement measure

Electronics Forum | Wed Oct 13 12:12:04 EDT 1999 | Bill Haynes

Hello Morris, I hope that my superiors don't see your message or they might have me go through all of that to calculate my cost per part mounted. One of the things that has helped me out considerably is an Accounting report that gives me all


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