Electronics Forum | Thu Aug 23 16:41:06 EDT 2001 | slthomas
Naw, the rest of the BOARD we use them on. Same assembly. Actually we use them on one other assembly and have the same problem. Same oven, same line, same paste, same problem. I've tried to get the production super. to move them to another line w
Electronics Forum | Wed Nov 28 09:17:17 EST 2001 | Dave G
I've heard of reliabilty problems caused by wave soldering melf's as well. We don't put Melfs on the bottom of our PCB's on newer designs. We only have to deal with gluing & putting them through the wave on some of our older legacy designs. Increasi
Electronics Forum | Tue Sep 04 13:41:52 EDT 2001 | Brian W.
IPC7912 deals with the end result, ie an OEM getting boards from a contract manufacturer. I have a friend who is sitting on these committees. He tells me there is a new standard due out for actually doing in-process DPMO. From a process standpoint
Electronics Forum | Sun Oct 07 07:34:25 EDT 2001 | davef
No one wants to be limited to one alternative in evaluating such equipment. Who would you suggest as viable alternatives to: * Cyber Optics in evaluating alternate suppliers for inspection equipment? * Royce Instruments in evaluating alternate sup
Electronics Forum | Thu Sep 06 13:19:36 EDT 2001 | mparker
The main criteria is at what frequency is the RF operating? If it's in the microwave region, forget no-clean. Low frequencies - 0 to 100 MHz, probably ok. Beyond that, it's application specific. Depends on components used and circuit design. The p
Electronics Forum | Tue Sep 11 19:54:52 EDT 2001 | gsparka
HELLO. SMTNETERS there is no company in high mix low volume system in our contry so . what is the best way to calculate the capa. of smt line in high mix low volume. & what is the general way to get the defect rate to evaluate the smt line(or sm
Electronics Forum | Thu Sep 13 17:57:59 EDT 2001 | davef
You're correct. It is curious. Possible angles to look at are: 1 WS609 loves moisture in the air. In high humidity shops, this paste hakes-on liquid. If this is the case, you should also see slumping, resulting in fine pitch bridging, and solder
Electronics Forum | Fri Sep 14 15:23:41 EDT 2001 | davef
I saw your earlier postings on the topic, but am not familiar with Print Pro-E Drawings. Have you tried the common Gerber viewers? Like: * View Mate (View only) - http://www.lavenir.com * CamCAD (View only) - http://www.camcad.com * GC-Prevue (View
Electronics Forum | Tue Sep 18 15:35:23 EDT 2001 | jschake
A laser cut stainless steel stencil was used exclusively for the evaluation of the complete 0201 assembly process, which addressed printing, placement, and reflow. However, I have also conducted off-line 0201 print tests using a nickel electroformed
Electronics Forum | Wed Sep 26 16:32:40 EDT 2001 | davef
Placing a component the correct side up: * May affect heat dissipation. [Umm, that sounds like stretch, but who knows what designers think about?] * Allows reading the markings on those components that have markings, however cryptic the notation of
