Electronics Forum | Tue Jan 13 19:16:42 EST 2004 | gregp
Ron, No one asked you about future of Contact Systems. It sounds like you are feeding on the B.S. magellan has been telling everyone. Why don't you get your information from reliable sources (such as Contact Sytems) rather than those with obvious a
Electronics Forum | Thu Jan 29 00:10:17 EST 2004 | Vinny
Hi Dave, Thanks for your reply. I have tried getting the design changed from the customer but they cannot provide thermal relief as this changes the RF performance and they cannot afford to do that. As for profile it does reach the reflow tempera
Electronics Forum | Thu Jan 29 06:58:40 EST 2004 | davef
Ramp / Soak: Tombstoning is occuring during reflow. You need to get more heat into the ground plane. Obviously a ramp aint gettin' it done. Further, without intending to disrespect your internal discussion, if a linear profile improved the situati
Electronics Forum | Tue Feb 03 12:39:20 EST 2004 | paul_bmc
We had the data at the time and it was quite high. More false calls then anything. I do not have the data anymore it since has been archived. When the system was introduced we had 1 engineer and 2 operators trained for programming and running the
Electronics Forum | Thu Jan 29 16:10:09 EST 2004 | blnorman
Another equipment manufacturer is Smart Sonic. Most equipment manufacturers have their own chemistries, but they are also willing to use other cleaners. What we have done is to send boards that need to be cleaned to the equipment manufacturer. W
Electronics Forum | Wed Feb 11 12:06:38 EST 2004 | Ventrista
Forgive me for opening a can o' worms but is anybody familliar with this organization? A little alarmist in nature, but I have to admit to the devastation I've seen! "The China Challenge: China is destroying the American manufacturing sector indust
Electronics Forum | Mon Feb 16 15:47:54 EST 2004 | Jim
I have about 200 PCB's from which a 20mil pitch QFP must be removed, cleaned and re-used (will place them back in trays for the P&P machine to place the parts on new boards). My intitial concern is: how can we remove the parts in an efficient manner?
Electronics Forum | Tue Feb 17 10:55:49 EST 2004 | bobbyv40
Hi Dave, 1. As far as speed of removing componants, we use a board preheater to bring board temp to about 150 C. Then add a flux and then flood all 4 sides of the componant with the low temp solder. Using a suction tool the part comes right off. The
Electronics Forum | Mon Feb 23 20:19:15 EST 2004 | greg york
Has anyone ever seen a bulbous joint (on 1 side > of 1 designator) on every board? I checked the > preheat profile at the wave and have played with > dwell times but can't get rid of it. I checked > the archives and didn't find much. Any help wou
Electronics Forum | Tue Mar 02 17:26:24 EST 2004 | pjc
I worked on MicroFlex. All axis move via electric motor drive. Carraige reapatability is +/- 0.0005" (12 micron). Cameras position more easily on linear bearings than the swivel type. The alignment accuracy and repeatability easily supports sub-20mil
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