Electronics Forum | Tue Jul 17 22:32:30 EDT 2001 | CAL
One Inspection Unit was from Original Solutions. It was mid way through the line near the Fuji machine. If this is the system contact Mike Feld at OriginalSolutions.com The give away did no require sophistication and dont think there was two AOI unit
Electronics Forum | Fri Dec 24 04:22:11 EST 1999 | Keith Stone
When you get to fine pitch you might want to try reducing the aperture on the long dimension of the pad only. If you reduce the width of the pad you can get solder paste left in the stencil giving insufficient or unsoldered joints. Reducing the lengt
Electronics Forum | Wed Oct 20 09:27:31 EDT 1999 | Bill Strachan
I suggest that you get a copy of IPC -SM-782A 'Surface Mount Design and Land Pattern Standard'. This gives component dimensions and recommended land patterns for nearl all surface mount components. You could also benmefit from a copy of TopLine Dummy
Electronics Forum | Thu Apr 29 13:22:14 EDT 1999 | Frank Clark
| What is a Quad 100 with vision and glue dispenser worth these days? |I'll be glad to give you a better appraisal with a few more details. (Feeder count, type of feeders, system condition, number of chucks) Please give me a call at 603-594-4229 Th
Electronics Forum | Tue Feb 24 18:21:52 EST 1998 | Graham Naisbitt
You should refer to the IPC-J-STD001B and IPC-TM-650, they will give you good recommendations. Also, we do new reliability test systems and if you can give me your address and e-mail, I will send you some more info. Regards, Graham Naisbitt | looking
Electronics Forum | Fri Feb 13 03:26:07 EST 1998 | Brian S. Bentzen
Hi , The 4th stage in reflow soldering, the cool-down, I find is often over looked. A rapid cooling rate should give finer lead and tin structure with more bindings and thereby result in stronger solder joints. Can anybody give me some information
Electronics Forum | Tue Sep 10 07:24:13 EDT 2002 | John
I need teoretical info for theme "Matted surface vs solder ball". Is it right that some solder pastes decrease solder balling but give matted surface after reflow? That diference between these pastes and others? Are the matted surface worse solder b
Electronics Forum | Fri Oct 18 22:32:20 EDT 2002 | mdm4ua
If you have room try putting a small piece of tape on the bottom of the stencil right next the aperture that is giving you the problem. The added height of the tape (Kapton tape is usually about 3 mils thick) will likely give you a heavy enough depo
Electronics Forum | Thu Nov 21 14:17:27 EST 2002 | MA/NY DDave
Hi I can't give you the answer for your question because I have too many questions and would have to know a lot more before I was comfortable giving any advice. I have done mass Baking of piles of PCB's as a needed evil when piles of boards were ex
Electronics Forum | Mon May 19 02:59:04 EDT 2003 | emeto
Hi, I can give you a few steps. 1. The solder paste. Take the profile that manifacturer gives for the paste. 2. Use termocouple to measure the tempereture. Put PCB and measure the temperature in equal terms. 3. Compare your profile to manifacturers
