Electronics Forum: give (Page 286 of 455)

Factory Lighting - specs and measurement ?

Electronics Forum | Mon Jun 17 15:04:08 EDT 2002 | genny

I think I had my units wrong in my previous post - that blueprint job was 6 years ago and fading fast. My level of 700 would have the same units as Dave's level of 1000. This is the metric measurement of lux, vs the imperial footcandles. fc to lux

Placement machine comparison

Electronics Forum | Mon Jun 17 09:41:41 EDT 2002 | caldon

I always look into the Support Structure (Service, Applications, Training, Project/product management) of the organization. With that said I have to give Assembleon the edge. I also like the relationship between Cookson and Assembleon. Cookson Perfor

Comparison between Glue & solderpaste process

Electronics Forum | Fri Jun 21 10:22:13 EDT 2002 | russ

A lot of your success with waving SMT components is dependent upon design and what type of wave forms you use. Without knowing how the board is laid out or what type of wave you have it is pretty difficult to determine what the yield differences wil

Reflow PBGA

Electronics Forum | Tue Jun 25 15:30:49 EDT 2002 | Steve L

Hi everyone. I am now faced with a problem on soldering PBGA. At first, I ran the board (FR4, 7" X 10" with 12 layer) at Peak Temp: 205 C and 54 seconds above 183 C. After reflow, I found several cold solder joints and one ball without second collaps

Reflow PBGA

Electronics Forum | Wed Jun 26 21:41:46 EDT 2002 | ianchan

Hi mate, "no more than 6hrs in the stencil" for us means: 1) we finish setup of reflow oven, P&P m/c, and lastly the printing machine(includes loading of stencil into printer machine). 2) once printer machine is setup, we rip-open the paste Can pr

Palladium finish and solder balls

Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied

Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run

How to clean white residue

Electronics Forum | Mon Jul 01 20:44:17 EDT 2002 | davef

Actually, the white res were caused by the water carrier in your Lonco 23F reacting with the res from the nc flux used to solder the component in place. Comments are: * Some nc flux res are cleanable, some are not. Your supplier [Alpha?] can probab

capacitor leakage

Electronics Forum | Wed Jul 10 18:19:42 EDT 2002 | davef

Flex cracking under the terminations is generally regarded as one of the primary causes of failure of ceramic chips. If you can see cracks in the solder joints from board flex, those chips are certainly strongly suspect, and you must assume there is

MyData and their position on used equipment.

Electronics Forum | Thu Jul 11 14:59:22 EDT 2002 | pjc

Right or wrong, Mydata has a "second user" registration fee policy in order to recieve support. If you paid the fee then you get support. If you are a re-seller and not the end-user, that may explain the treatment you are getting. If you are an end-

dry oven

Electronics Forum | Wed Aug 07 09:05:11 EDT 2002 | davef

N2 PPM vs %RH? With a firm grasp of the obvious, reflow oven manufacturers rig N2 ovens differently than non-N2 ovens. The N2 displaces O2. Usually N2 oven monitor something or other to give an indication of N2 ppm. %RH really isn't part of the eq


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