Electronics Forum | Wed Apr 17 23:00:11 EDT 2002 | lysik
A DEK 265 Mark 1 is an old system. That does not mean that it does not work well. It is a very good system. It has however past it's 7 year support life. As far as a person that works for a OEM working on your machine there is no law that says he or
Electronics Forum | Tue Apr 16 13:59:33 EDT 2002 | paulausten
They work great as long as your conveyor speed > has been calibrated and checked on some type of > PM schedule. On some oven types these sensors can > warn you to possible problems with the conveyor > speed. Say the oven is calculating that the b
Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).
Electronics Forum | Fri Apr 26 20:11:51 EDT 2002 | stefwitt
Ian was quite right, mentioning the Nitto patent. It is Pat# 4,820,369 from April 1989. The idea is great, but there are quite some hick-ups in practise. P.S. The reasons for the difficulties with the �cover tape curl� are easily explained. Try to
Electronics Forum | Fri May 03 18:10:17 EDT 2002 | stownsend
Okay, here goes another thread about gold plating. I have been using gold plated PCB's for about two years now, with mostly very good results. The main reason I started using gold in the first place was because it is flat, solder wets to it nicely,
Electronics Forum | Thu May 09 17:16:16 EDT 2002 | davef
Russ makes a good point. While your profile probably meets your paste supplier recommendations, it may not be proper for the component. * Paste suppliers offer general recommendations for tin / lead interconnects. You need to modify that for board
Electronics Forum | Tue May 07 15:24:13 EDT 2002 | gregp
I believe Mitutoyo makes a CMM for that application. They were soliciting the idea at APEX show a couple of years ago. I believe they were going to develop some software to do just what you are asking for (following the IPC-9850 format). A CMM, ho
Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi
*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about
Electronics Forum | Wed May 29 08:28:41 EDT 2002 | zanolli
Hello Mr. Peterson, I don't know where you're writing from, but if you're more than 25 miles from Rhode Island, I'll humbly and graciously accept the "expert" title. In general, I have to say that the backpanel removal tools are worth the money. As
Electronics Forum | Sat Jun 08 01:31:19 EDT 2002 | fastek
It should be easy enough for you to do your own study to determine if you need more people or not. The first thing that I would do is optimize or balance your line to the optimum efficiency. That is not a difficult task. Once that is done, analyze yo
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