Electronics Forum: glass substrate (Page 1 of 4)

PCB's using Kevlar substrate

Electronics Forum | Thu May 09 17:21:39 EDT 2002 | davef

In describing a bare board, you need to talk about base, laminate, and conductive materials. Common laminate materials are: * Glass fabric * Cotton fabric * Paper Common NEMA grades of technical laminates are: * Glass Fabric Grades: G3, G7, G10,

Re: Relationship between BGA and PCB substrate

Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon

| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F

Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process

BGA vs. QFP Packaging.

Electronics Forum | Sat Nov 06 14:39:50 EST 1999 | Gary Moravchik

I am seeking sources of reliability and thermal stress data that compares BGA (50mil ball pitch) to QFP (20mil lead pitch)packaging for automative applications. Substrate material is epoxy glass. The ultimate goal is to collect sufficient data to hel

Palladium poor wetting

Electronics Forum | Thu May 25 03:31:17 EDT 2006 | slaine

Hi I manufacture ceramic parts that have a terminations that are palladium/platinum/silver or any combination of the 3. Termination Ink usually consists of 3 main parts the alloy, glass frit and binder. Binder is to help bind everything together whi

Laser trimming of resistors on PCB

Electronics Forum | Tue Jan 30 21:15:51 EST 2001 | davef

You seem to pretty far from shore to begin thinking about boats and floatation devices. Most laser trimmers are used by: * Semiconductor fabricators * Resistive component fabricators * Hybrid circuit assemblers Component fabricators and hybrid [

SOLDER BALLS

Electronics Forum | Tue Apr 28 21:48:50 EDT 2009 | davef

Confirm the source of the issue. Run a coalescence test on both lots of paste. A simple coalescence test can quickly determine the condition of solder paste after prolonged use. Simply print a small disk [around 4-5mm diameter and 0.2mm thick - a bu

Re: BGA warpage

Electronics Forum | Thu Jan 21 15:24:18 EST 1999 | Terry Burnette

| I have received prototype PBGA (256 pins) devices from | Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I h

Thermo-couple attachment

Electronics Forum | Wed May 07 11:31:21 EDT 2003 | cyber_wolf

Well Dave, Check the number that is on your adhesive tube. They make several different types of adhesives for use on different substrates. The rep from Dymax recommended the 3073 for bonding to FR4. We use a Dymax HHL400 handheld curing light. Click

Re: Solder Resist Solder balls

Electronics Forum | Tue Dec 22 12:32:16 EST 1998 | Earl Moon

| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,

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