Electronics Forum | Thu May 28 09:30:42 EDT 1998 | Chrys
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Mon May 18 20:57:06 EDT 1998 | Earl Moon
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get in
Electronics Forum | Mon May 18 22:54:04 EDT 1998 | Dave F
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get
Electronics Forum | Wed Apr 08 12:46:04 EDT 1998 | Justin Medernach
| Any one have any experience with or knowledge of the Panasonic HDP-G1 adhesive dispenser, or any other Panasonic dispensers. Ron, I have used this piece of equipment and I'll tell you what I tell everybody else about it. I don't trust it. That's
Electronics Forum | Thu Aug 23 20:51:15 EDT 2001 | davef
Every thing you need is in "links" here http://packaging.hp.com/. The only thing you need to do now is find it. Ah, so much information, so little time. Yeh yeh yeh, nice little ESD bags are good. Er, maybe sealed barrier bags might be better. E
Electronics Forum | Sat Dec 01 09:09:24 EST 2001 | davef
Sounds like a perfect place to start. Sure we all have different perceptions of fun, don't we? Trial by fire, eh? ;-) A prediction: Your cost accountants are going to freak when they compare the production costs for this board to the more famili
Electronics Forum | Tue Dec 11 17:55:07 EST 2001 | davef
Ah, a desperate one. The kind we prey upon, mmm Several points are: * There are ample sources of information on the net that describe the fabrication of prototype boards. * Search the fine SMTnet archives for additional information. For instance:
Electronics Forum | Mon Apr 29 07:52:43 EDT 2002 | stefwitt
Shall we designers ignore what component vendors recommend how to peel off the cover tape? See Performance Note: http://www.kemet.com/kemet/web/homepage/kechome.nsf/vapubfilesname/F3102GTaCerPkg.pdf/$file/F3102GTaCerPkg.pdf P.S. Also, note the decen
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Tue Jun 11 14:45:59 EDT 2002 | stefwitt
I can not find a F4G in Fuji�s equipment list. Siemens has a F4 ( flexible fine pitch machine ) and also a GII ( glue dispensing machine ), which both would make sense to add to your equipment list. Machines are �connected� together with their conve
