Electronics Forum | Tue Jul 28 10:55:54 EDT 1998 | Jose Moreno
| Dear sirs, | please help me to fing a company whicjh produces white or yellow adhesive UV curing glue for SMT components assembly ,i need names and contact fones and faxes for those company ,i need any company but not Alphametal or heraues | th
Electronics Forum | Wed Feb 16 09:30:11 EST 2000 | MARK ALDER
Please refer to the archives on SMTNET date 02/19/1999 on aperture sizes for printing SMD adhesives. Regards Mark Alder
Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal
For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o
Electronics Forum | Sun Feb 13 19:04:13 EST 2000 | Jackie Hsieh
First I'm a Taiwanese people so excuse my bad english writing. On my experience, The process of double side SMT procedure with two methods ---First one is appling the glue on the solder side, and placeing the R,C,L chips components on it.and 2nd one
Electronics Forum | Mon Jul 27 12:24:29 EDT 1998 | Bill Schreiber
Ablestik 20021 Susana Rd. Compton, CA 90221 Tel: 1(310) 764-4600 Fax: 1(310) 764-2545 Grace 55 Hayden Ave. Lexington, MA 02173 Tel: 1(617) 861-6600 Fax: 1(617) 861-9590 Emerson Cumings makes a yellow. However, I do not have any contact info. Good luc
Electronics Forum | Mon Feb 14 12:39:41 EST 2000 | Dave F
Francois: Sound like a messy process to me. Choice #1: Put only SMT parts on the primary side Choice #2: Put only SMT parts on the primary and secondary sides Choice #3: Put only SMT and PTH parts on the primary side Choice #4: Put only SMT and
Electronics Forum | Tue Feb 15 13:16:02 EST 2000 | Rob Fischer
Don't feel alone. Many assemblers have the same problem but aren't fortunate enough to have say in the design of the board. They're either have a capital invedtment in a selective solder machine or pallets designed to mask bottom-side SMD. The pal
Electronics Forum | Thu Feb 17 10:14:40 EST 2000 | Jim N
We bulid many boards with fine pitch on solder side and then wave. We use a wave fixture that is custom for each board. The fixture covers the SMT components and only exposes the PTH lead during the wave process. It requires about .070 to .100" clear
Electronics Forum | Mon May 29 02:15:06 EDT 2000 | Dreamsniper
Hi Buddy, We've tried shifting to this process before and from our point of view here are some of the advantage and disadvantages that we discovered. Advantage 1) Cheap Equipment cost as you just need to use your Solder Paste Printer rather than buy
Electronics Forum | Tue Mar 07 01:54:09 EST 2006 | karenp
I'm getting a poor glue application in the smt process I have a Gemini machine and I need an efficient method to analyse the consistence and inspect the process by the operator.
