Electronics Forum | Mon Apr 22 13:05:52 EDT 2002 | davef
Try: Somar Corporation, 11-2, Ginza 4-chome, Chuo-ku Tokyo 104-8109, JAPAN http://www.horiba.co.jp/ +81 3 35422151 +81 3 35422056 Not to imply there is anything wrong with Somar's material [having never used the material], just looking at an alterna
Electronics Forum | Wed May 08 23:19:12 EDT 2002 | Jones
We currently use the Mitutoyo vision measuring machine Model #qv202-pr05f. We use it as a tool for measuring placement accuracy on both our chipshooters and glue machines. It also has the ability to check the glue dots for accurate sizing. As far as
Electronics Forum | Mon Oct 21 10:05:53 EDT 2002 | John S
We just started using DEK's pump print process on a high volume SMT line. We are using Hereaus 955. It works well for most components, but we have an issue with missing/partial glue dots on large diameter deposits (0.050"). The stencil will be com
Electronics Forum | Sun Dec 01 00:28:41 EST 2002 | yngwie
What is the danger of using the expired glue or Loctite ? I'm using Loctite 383 and the expiry date was Oct 20th. I refused to use them, and my refusal has caused the downtime incured for 8 hours. Felt guilty, as I knew this glue can still be functio
Electronics Forum | Mon Feb 24 20:51:52 EST 2003 | davef
Ryan, You are spot-on with your analysis of the 'flattened' glue deposits. How about this for a different approach[es] in explaining your method for removing caps from your board? * George Verboven has speculated here on SMTnet that the downward fo
Electronics Forum | Fri Mar 21 18:12:31 EST 2003 | Judy
I look at boards coming out of the oven top side and bottom If I take that board after its been glued on bottom side out of the oven and look at the top side when I pick up that board you should see the glue parts that fell off you really have to wa
Electronics Forum | Tue Jun 17 09:22:02 EDT 2003 | davef
Higher that recommended is more brittle. Look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=17906 Q2: Will some of my Ceramic Caps crack during the wave soldering process because of the heat? A2: Probably Q3: Can you see any pos
Electronics Forum | Wed Feb 09 12:31:54 EST 2005 | russ
We are not doing this right at the moment but I have done it with great success. Of cource it depends on your pad layout we have a 20 mil gap in between pads, we printed at 10 mil wide with a 5mil stencil. I will try to find the glue we used, I kno
Electronics Forum | Mon Sep 19 08:36:53 EDT 2005 | lloyd
I had a similar problem a few years ago when glue printing. Our production environment wasn't to clean room standards and there was a bit of air born contamination floating around which would gather on the PCB surface (also our rough board edges wou
Electronics Forum | Wed Jun 14 21:49:42 EDT 2006 | davef
Bryan: * Most of our stencils are made from stainless steel that is held by a aluminum frame, attached with epoxy with a fiber glass intermediary between the frame and the stencil. * We use stencils to print either glue [thermoset epoxy] or solder pa