Electronics Forum: glue and big and components (Page 1 of 5)

SOT23s and paste + glue

Electronics Forum | Mon Dec 22 20:16:17 EST 2008 | davef

The first question in solving the "ol' SMT component loss after second-side wave operation" problem is: So, what makes you think the components actually came-off in the wave and not during some previous 'handling'? Putting that aside, we'll play thi

Re: Reflow glue and past.

Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter

I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Laying down and holding large components

Electronics Forum | Thu May 22 14:16:40 EDT 2003 | MikeF

We need more information to give you a good answer. Is this a leaded part (axial or radial) or smt? How big is the part, how much weight per lead? What is the end use environment, will it see any vibration? or temperature extremes? Some general com

Kester R562 and using lead free components

Electronics Forum | Fri Jul 06 13:44:15 EDT 2007 | shrek

Krikies! seems like a head-scratcher if I may say so me-self. I would say the other ogre is right, that surface finish will play a big factor in your solder joint's grain structure or how shiney 'tis. Non-HASL bearing finishes will typicaly exhibit

Solder Paste and fine pitch components

Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.

We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he

Simultaneous pick up with 0402 and 0201 components

Electronics Forum | Thu May 12 00:18:55 EDT 2016 | darby

Sorry for delay - been flat out. Sr - I understand what you are saying. My concern is that combined with the head offsets and variations in pick points (i.e. having to teach feeder positions for very slight amounts like 0.05mm)then you cycle times wi

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW

Hi, I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) Sec

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