Electronics Forum | Wed Oct 09 14:15:56 EDT 2002 | slthomas
Pardon the cross-post from the design board....I thought maybe I should query both populations. Is anyone out there aware of any standard or even a section of a standard that specifically addresses design guidelines for two-sided assemblies, particu
Electronics Forum | Wed Oct 09 11:59:56 EDT 2002 | slthomas
Is anyone out there aware of any standard or even a section of a standard that specifically addresses design guidelines for two-sided assemblies, particularly one that focuses on different processes? I'm being asked to produce information from said
Electronics Forum | Tue Feb 04 09:03:45 EST 2003 | Russ Roberts
Greetings, I am pretty new to SMT production, and have learned much from this forum. I am getting ready to build a CCA with many 0402 parts that are really close together. I consider these fine pitch. The board also has two QFPS, so my stencil design
Electronics Forum | Sat Feb 12 10:33:31 EST 2000 | Francois Racine
First I'm a french people so excuse my bad english writing. I have a complete smt production line. First a screen printer DEK 240, a chip shooter PANASERT MVIIV, a multifonction machine MULTITRONIKS EP6000, a reflow oven at the end of the SMT line a
Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef
For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components
Electronics Forum | Tue Feb 15 13:16:02 EST 2000 | Rob Fischer
Don't feel alone. Many assemblers have the same problem but aren't fortunate enough to have say in the design of the board. They're either have a capital invedtment in a selective solder machine or pallets designed to mask bottom-side SMD. The pal
Electronics Forum | Fri Jun 19 07:49:03 EDT 2020 | alanyang
Hope it's helpful for this stencil design.https://pcbboardassembly.com/how-to-understand-ipc-7525a-stencil-design-guidelines/
Electronics Forum | Wed May 08 21:43:12 EDT 2013 | davef
IPC-7525A - Stencil Design Guidelines
Electronics Forum | Mon Dec 22 11:09:21 EST 2008 | mfcat
We changed paste manufacturers rather recently and are now seeing SOT23s falling off after wave solder. These parts have a dual process... we stencil print paste, apply glue, populate then reflow. Only SOT23s fall off, chips are fine. We do not be
Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal
For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o
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