Electronics Forum | Thu May 10 18:23:50 EDT 2007 | wayne123
I was just wanting to know some of the advantages/disadvantages of going gold immersion? Is this neccessary for Lead free?
Electronics Forum | Tue Jun 05 10:07:26 EDT 2007 | stepheniii
I think the point the others are missing is that the solder gives off the exact amount of heat required to melt it when it goes solid. That is the heat it gives off when going solid equals the heat it takes to melt it. And while the solidifying solde
Electronics Forum | Tue May 22 09:37:11 EDT 2007 | jdengler
Hi Joakim, I do not know the QP242 table, but on our GP-341, CP-IV-2 and IP-III we make a plate from plexiglass with milled holes to show where the supports go for each board. This is not as fast as the Gridlock but does not cost nearly as much. J
Electronics Forum | Fri Jun 08 13:51:03 EDT 2007 | scooter
I guess i don't understand: if your are going to wash the boards anyway why not use a water soluble flux?
Electronics Forum | Mon Jun 18 10:34:40 EDT 2007 | swag
If you are using a fixture/carrier in the oven, make sure that it is not too restrictive on the perimeter of the board/panel. A carrier intended to limit warpage can actually cause warpage if the expanding PCB material has no place to go during refl
Electronics Forum | Mon Jun 18 10:02:26 EDT 2007 | dyoungquist
5mil should work fine. Some stencil manufacturers charge more if you go less than 5mil so stick with 5mil.
Electronics Forum | Wed Jul 11 14:05:40 EDT 2007 | fredericksr
Mr Tech, No steaks for you yet. I'm going to run some extensive tests on the centering system, but I have identified problems with the vacuum system as well. Thanks!
Electronics Forum | Wed Jul 11 14:20:31 EDT 2007 | fredericksr
The steel belts are still suspect. I'm going to perform a thorough analysis of the centering system soon. Will let you know.
Electronics Forum | Fri Jul 20 16:39:18 EDT 2007 | john_smith
Jacky, we have had a similar problem. We needed to go to a smaller nozzle and also check your vacuume system and air kiss.Could be after placement when the machine blows air to insure the part is off the nozzle that it is effecting the solder brick.
Electronics Forum | Thu Jul 19 06:57:15 EDT 2007 | cyber_wolf
Peter, GO TEST YOUR SMALL X-MOTOR IN THE SERVICE PROGRAM !!!!!! Do not start changing parameter files ! I assume that your machine worked fine at one time with the original parameter file.
