Electronics Forum | Mon Aug 11 08:56:28 EDT 2008 | ethancw1sel
The technical support department at Hover-Davis has been very supportive in getting our issues cleared up. And they continue to be so. I was just trying to guage other operators trends with them. I believe we own some odd 600 feeders of various si
Electronics Forum | Sun Sep 07 17:16:57 EDT 2008 | gregoryyork
OK Pizza it is then, here goes. Dewetting of Ni/Au pads, paste favouring the Tinned component lead hence excess paste wicking on top of the components. Reason is EITHER Nickel migration into the gold due to high levels of Ionics from poor rinse OR mo
Electronics Forum | Mon Oct 20 15:41:19 EDT 2008 | patrickbruneel
Josh, You can not check the bare boards for black pad unless you remove the gold plating. Like Robin said black pad is nickel oxidation/corrosion and a result from bad electroless nickel plating bath control. The only preventative action you take is
Electronics Forum | Thu Dec 18 14:38:41 EST 2008 | easton
I think the BLT solder joints look very shiny for no-lead. We are getting very good top side solder with ours though. They look like this. - Gold Enig plating - Alpha EF-6100 Flux - SAC305 - Preheat topside temperatures at 110 to 120C
Electronics Forum | Wed Feb 04 06:26:20 EST 2009 | sachu_70
Hi Peter, The defect you observe during the second side reflow could be caused due to improper Au plating thickness in the PCB fabrication process. You can refer IPC-2221 wherein plating thicknes for ENIG mentions 0.08um to 0.23um for Immersion Gold,
Electronics Forum | Thu Mar 05 21:31:35 EST 2009 | davef
Bill: We're pretty sure these guys don't offer the parts that you seek, but they maybe able to give you a lead. * Topline Dummy Components - http://www.topline.tv * Practical Components - http://www.practicalcomponents.com So, how about your equi
Electronics Forum | Tue Aug 25 06:11:13 EDT 2009 | ghepo
Eric, use the TM 650 test method annexed. Don't forget to perform many test on many PCB (TOP and BOTTOM)on PADs in several position (at 4 corners and at the center) and obviously in the faulty position. Don't forget to change every time the tape. V
Electronics Forum | Fri Nov 20 12:41:41 EST 2009 | brycearkos
Has anyone attempted to, or successfully used a custom made (DIY) protective thermal enclosure for the Super M.O.L.E. gold profiler? We recently purchased a Bravo oven that came with everything for the ECD profiling system... except for the thermal
Electronics Forum | Tue Feb 16 21:29:18 EST 2010 | actioncontrols
I predict you will have no problems with your soldering. Remember that all plating is only a few microns thick and quickly washed away by the molten solder. We have used white tin, immersion gold, OSG, etc. for quite a while with leaded solder and
Electronics Forum | Sun May 02 11:44:03 EDT 2010 | davef
J-STD-001 is your base requirement, but MIL and SPACE have stringent requirements for soldering gold plated terminals, e.g. this typical one: http://xweb.nrl.navy.mil/glast/CALDesign/CDE/CAL%20DPD%20Wire%20Cable%20Soldering%20and%20Staking%20Spec%20
