Electronics Forum: gold (Page 151 of 172)

Pattern matching type fiducial at Topaz/ Emerald machines

Electronics Forum | Thu Mar 22 17:24:19 EDT 2007 | coop

Have you tried changing the algorithym type in mark info. to special 1 or 2 ? you will have to perform an F6 on this after you change it. If you were on Normal before then you will want to lower the threshold from the what you have it set at ,probabl

COB pad contamination from kapton tape adhesive

Electronics Forum | Tue Jul 10 07:22:48 EDT 2007 | davef

Q1. Is kapton tape an industry accepted way of protecting gold pads from solder splashes? A1. No. It is more accepted to resolve the reason behind the solder splats, so that the added labor and cost of taping is eliminated. Search the fine SMTnet Arc

RF BOARD + SOLDER PASTE TYPE PROBLEM

Electronics Forum | Mon Nov 05 19:37:32 EST 2007 | davef

You weren't specific about the frequency band were you're operating. So, let's pound a couple of stakes in the ground. * Conventional tin-lead plating of 200-300 �m is quite satisfactory for lower frequencies in the range of 2GHz. * At frequencies h

RMA flux affecting surface tension

Electronics Forum | Tue Aug 26 12:52:04 EDT 2008 | circleprime

I have recently started to use RMA flux (customer requirement) for some of our projects. I am finding that some of my BGAs are slightly off. Not enough to be rejected but enough to cause concern. In the past I have been able to rely on the surface te

SN100C alloy positive and negatives

Electronics Forum | Wed Dec 24 15:28:17 EST 2008 | edmentzer

We use SN100C for wave soldering and hand Lead free soldering and have had very good results. The wire cored solder for hand soldering flows good and makes very good solder joints. The SN100C in the wave solder machine also works very good. We use

Soldering problem with Au plating PCB

Electronics Forum | Sun Jan 25 17:40:16 EST 2009 | cuperpeter

Hello All, I have a problem with nonwetting Au finish after second cycle of reflow soldering doublesided boards. Solder nonwetted pcb pads (is wicked to component terminations) Either these pads or some of non component pads became discoloured from

Soldering problem with Au plating PCB

Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter

Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became

Low Silver Solder Problems

Electronics Forum | Sun Aug 23 07:03:09 EDT 2009 | ghepo

OK Eric, is difficult answer at distance without examine the PCB..., anyway in my opinion the problem is the PCB quality. There are two possibility : the crack is between solder and nickel or is between nickel and pad copper. In both situation the

ionic residues on the surface of printed circuit assemblies

Electronics Forum | Mon Aug 31 21:47:56 EDT 2009 | davef

In response to your question: 3 Saponifier / non saponifier 3a Saponifiers: * Aqueous Technologies: PCB-Wash http://www.aqueoustech.com * Kyzen: XJN http://www.kyzen.com * EnviroSense: Enviro Gold #816 http://www.envirosense-inc.com 3b Non-Sapo

High Melting Point Solder Paste

Electronics Forum | Mon Dec 28 08:51:45 EST 2009 | jax

What solder are you talking about and what reflow method are you using? High Melt Alloys: SN96 (Sn96/Ag4 or Sn96.5/Ag3.5) - Simliar to SAC305 although normally uses Rosin based flux that can required more extensive cleaning. Pb85 (Pb85/Sb10/Sn5) -


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