Electronics Forum | Thu Jun 23 23:58:03 EDT 2011 | jamessunderland
Just want to ask. What is the effect of dull gold surface on solderability? When I made a test run with several pieces containing dull gold defect on the pad(of varying levels), I found that components can still stick to the pad with good amount o
Electronics Forum | Wed May 09 17:28:25 EDT 2018 | davef
You can't find a hardness spec for immersion gold [ImAu] because no one cares. The ImAu dissolves into the solder during thermal processing. Pressed, I'd guess for that ImAu hardness is about that of soft gold * Soft: 50-90 knoop * Hard: 130-200 k
Electronics Forum | Fri Jan 21 12:36:52 EST 2022 | stephendo
Like I said a lot of people don't tape the gold fingers the first time they run them. After that they make sure the fingers get taped up because solder gets places you don't think it does and once it touches gold, that gold is contaminated. How do y
Electronics Forum | Thu Nov 10 12:29:57 EST 2022 | stephendo
The G in ENIG is gold. It does not oxidise. Either you are thinking of OSP or your board shop is providing defective boards if your boards show oxidation. It would be the nickel that is oxidising but should be totally covered by the gold. Is there
Electronics Forum | Mon Jan 08 20:26:12 EST 2001 | Dave F
Ask your supplier if he will guarantee to cover rework, warranty, and lost business costs, if he's incorrect. Below 2uinch gold is very pourous and not worth anything in preventing corrosion of your nickel undercoat. 3 uinch has to be the absolute
Electronics Forum | Fri Nov 03 17:36:37 EST 2000 | Thomas Ballhausen
Thank you for your hint. According to the substrate supplier the thickness is less than 1 micron. After Ni/Co layer there is water rinse, then "gold strike", another rinse then "gold plating". But still the total Au layer shall be less than 1 micron
Electronics Forum | Tue Oct 26 08:17:54 EDT 1999 | William
Dave, Last question(s). What do I do about a gold porosity problem? Dave: How would I approach the board house to check for this? They use a very well known chemistry, but is that where the pblm lies? Or would it be in their process, cycle times
Electronics Forum | Thu Sep 16 17:22:16 EDT 1999 | DaveJ
We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a recomm
Electronics Forum | Mon Dec 28 12:16:40 EST 1998 | Jon Medernach
Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mechan
Electronics Forum | Tue Dec 29 10:24:35 EST 1998 | Earl Moon
| Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mech
